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Supporting and baking wafer boat

A technology of support plate and support mechanism, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of dumping wafers, damage, low stability, etc.

Pending Publication Date: 2020-10-27
芯米(厦门)半导体设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the wafer is placed and baked by the wafer boat, when the wafer boat is transported, it is easy to cause damage due to collision between the wafer and the wafer boat due to vibration. and the wafer is damaged due to tipping

Method used

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  • Supporting and baking wafer boat
  • Supporting and baking wafer boat
  • Supporting and baking wafer boat

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Embodiment Construction

[0024] The following will be combined with Figure 1-5 The present invention is described in detail, and the technical solutions in the embodiments of the present invention are clearly and completely described. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] The present invention provides a support baking wafer boat through improvement, including a side plate 1, a wafer boat main body 2 and a support mechanism 4. The side plate 1 is an integrated structure and is symmetrically arranged with two left and right ends of the crystal boat main body 2. part (the bottom of the left and right ends), and the left and right opposite sides of the two side plates 1 are provided with a placement groove 3, and...

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PUM

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Abstract

The invention discloses a supporting and baking wafer boat. The wafer boat comprises side plates and a wafer boat body, the supporting mechanism is arranged at the front end of the wafer boat main body; the ratchet wheel and the gear are driven to rotate by rotating the rotating rod; meanwhile, the gear drives the rack to horizontally move forwards; the rack drives the U-shaped plate and the clamping plate to move forwards to be clamped at an external designated position; meanwhile, the bent plate pushes the supporting plate to rotate backwards through the sliding rod to be attached to the front end face of the wafer, attachment protection of the wafer is achieved, and the beneficial effects that the wafer boat is stably and fixedly supported outside, and meanwhile the wafer in baking transportation is supported to be prevented from being collided and damaged are achieved.

Description

technical field [0001] The invention relates to the related field of wafer boats, in particular to a wafer boat for supporting and baking. Background technique [0002] In the semiconductor manufacturing industry, manufacturing integrated circuit chips from wafers usually includes several steps of wafer processing, testing, storage and handling. Due to the fragile nature of the wafer and its precious price, it must be properly protected during the manufacturing process, and the purpose of the wafer boat is to provide this protection. [0003] When the wafer boat is placed and baked on the wafer, when the wafer boat is transported, it is easy to cause damage due to collision between the wafer and the wafer boat due to vibration. Instead, the tipping occurs and the wafer is damaged. Contents of the invention [0004] Therefore, in order to solve the above disadvantages, the present invention provides a support bake wafer boat. [0005] The present invention is achieved by...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673
CPCH01L21/67303H01L21/67306H01L21/67309
Inventor 吴永利
Owner 芯米(厦门)半导体设备有限公司
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