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Image sensor packaging structure, lens module and electronic device

A technology of image sensor and packaging structure, which is applied in the direction of TV, circuit, electrical components, etc. It can solve the problems that affect the packaging quality of image sensor packaging structure, the large difference in the alignment of photosensitive chips, and the inability to satisfy users, etc.

Inactive Publication Date: 2020-10-27
FU TAI HUA IND SHENZHEN +1
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Problems solved by technology

[0002] The packaging structure of the image sensor includes modules such as a photosensitive chip, a light source, and a reflector. Currently, during the packaging process of the photosensitive chip, it is easy to cause a large difference in alignment between the photosensitive chip and the packaging structure of the image sensor, which seriously affects the packaging of the image sensor. The packaging quality of the structure cannot meet the needs of users

Method used

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  • Image sensor packaging structure, lens module and electronic device
  • Image sensor packaging structure, lens module and electronic device
  • Image sensor packaging structure, lens module and electronic device

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0017] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or inte...

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Abstract

The invention provides an image sensor packaging structure, which comprises a circuit board, a photosensitive chip and a mounting frame group, and is characterized in that the photosensitive chip andthe mounting frame group are both mounted on the same surface of the circuit board. According to the image sensor packaging structure provided by the invention, the alignment difference of photosensitive chips can be reduced, and the packaging quality of the image sensor packaging structure is improved. The invention further provides a lens module comprising the image sensor packaging structure and an electronic device applying the lens module.

Description

technical field [0001] The invention relates to the field of electronic and optical devices, in particular to an image sensor packaging structure, a lens module and an electronic device. Background technique [0002] The packaging structure of the image sensor includes modules such as a photosensitive chip, a light source, and a reflector. Currently, during the packaging process of the photosensitive chip, it is easy to cause a large difference in alignment between the photosensitive chip and the packaging structure of the image sensor, which seriously affects the packaging of the image sensor. The packaging quality of the structure cannot meet the needs of users. Contents of the invention [0003] In view of this, the present invention provides an image sensor package structure capable of reducing alignment differences of photosensitive chips, and improves the package quality of the image sensor package structure. [0004] In addition, it is necessary to provide a lens m...

Claims

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Application Information

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IPC IPC(8): H04N5/225
CPCH04N23/50H04N23/55H01L27/14618H01L27/14625H01L27/14636H01L27/14627
Inventor 倪庆羽呂香桦曾德恩
Owner FU TAI HUA IND SHENZHEN
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