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Hierarchical simplification method for welding spot fatigue analog simulation model containing multiple strands of wires

A simulation and wire technology, applied in the field of reliability evaluation research, can solve the problems of simple structure, unsuitable solder joints with multi-strand wires, and single scale, saving resources, reducing the number of grid cells, and improving reliability. Effect

Active Publication Date: 2020-11-06
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the existing solder joint simulation model has simple structure and single scale, and is not suitable for solder joints containing multi-strand wires, and provides a hierarchical and simplified method for the fatigue simulation model of solder joints containing multi-strand wires , by establishing a standard meshing method and hierarchical simplification method, the fast and reliable simulation of the fatigue characteristics of solder joints with multi-strand wires is realized

Method used

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  • Hierarchical simplification method for welding spot fatigue analog simulation model containing multiple strands of wires
  • Hierarchical simplification method for welding spot fatigue analog simulation model containing multiple strands of wires
  • Hierarchical simplification method for welding spot fatigue analog simulation model containing multiple strands of wires

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specific Embodiment approach 1

[0029] Specific implementation mode one: what this implementation mode records is a kind of method for grading and simplifying the fatigue simulation simulation model of solder joints containing multi-strand wires, and the steps of the method are:

[0030] Step 1: According to the relevant geometric parameters, the finite element model of the actual solder joint containing multi-strand wires and the finite element model of the solder joint containing only one multi-strand wire are constructed in the finite element analysis software. The shape of the strands is the same; the solder joint with only one multi-strand wire is the simplest solder joint with multi-strand wire, and it is necessary to establish a first-level simplification method based on the solder joint with only one multi-strand wire to simplify the actual multi-strand wire Strand wire solder joints. The actual multi-strand wire solder joint contains at least one multi-strand wire, can contain multiple multi-strand ...

specific Embodiment approach 2

[0036] Specific embodiment two: a kind of method for grading and simplifying the fatigue simulation simulation model of solder joints containing multi-strand wires described in specific embodiment one, the specific process of the second step is:

[0037] (1) Investigate the influence of the degree of grid subdivision of multi-strand conductors on the location of dangerous points, determine the area where dangerous points may appear and subdivide the grid in this area, and construct a standard grid division method for determining the location of dangerous points;

[0038] (2) Investigate the influence of the degree of mesh subdivision near the dangerous point on the fatigue life of solder joints, and construct a standard mesh division method for calculating the fatigue life of solder joints.

specific Embodiment approach 3

[0039] Specific embodiment three: a method for grading and simplifying the fatigue simulation model of solder joints containing multi-strand wires described in specific embodiment one, the specific process of the step three is:

[0040] (1) Investigate the influence of the length of the multi-strand wire protruding from the solder on the fatigue life of the solder joint, select the minimum value of the length of the wire protruding from the solder within the allowable range (± 15%) of the fatigue life of the solder joint, and Determine the length of the multi-strand wire protruding from the solder in the first-level simplified method;

[0041] (2) Replace the middle part of the multi-strand wire in the solder with an equivalent single-strand wire, and investigate the influence of the length of the unsubstituted multi-strand wire on the fatigue life of the solder joint, within the allowable range of the error of the fatigue life of the solder joint ( ±15%), select the maximum v...

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Abstract

The invention discloses a hierarchical simplification method for a welding spot fatigue simulation model containing multiple strands of wires. The method comprises the following steps: 1, constructingan actual welding spot model containing multiple strands of wires and a welding spot model only containing one strand of wires; 2, simulating fatigue characteristics of the welding spot model only containing one multi-strand wire, and obtaining fatigue characteristics of an unsimplified model; 3, simplifying the welding spot model only containing one multi-strand wire, and constructing a primarysimplification method of the multi-strand wire; 4, simulating fatigue characteristic of the actual welding spot model containing the multiple strands of wires, and obtaining fatigue characteristics ofthe first-stage simplified model; and 5, further simplifying the actual welding spot model containing the multi-strand wire, and constructing a secondary simplification method of the multi-strand wire. According to the method, the finite element model which is complex in mesoscopic structure and contains the multi-strand wire welding spots is simplified through the hierarchical simplification method, the number of grid units is remarkably reduced, and the calculation efficiency of fatigue simulation is effectively improved.

Description

technical field [0001] The invention belongs to the field of reliability evaluation research, and in particular relates to a method for grading and simplifying the fatigue simulation model of solder joints containing multi-strand wires. Background technique [0002] According to statistics, more than 70% of failures in electronic components and systems are caused by unreliable assembly. Solder joints are the most common connection structures in electronic assemblies, which mainly bear fatigue caused by alternating stress in the environment or work. Therefore, the problem of evaluating and improving the reliability of electronic assembly solder joints has always been an issue in the industry and academic circles. focus of the world. However, if we only rely on existing reliability tests to evaluate and optimize the reliability of solder joints, it will take a lot of manpower and material resources, and the development cycle will be long. In response to this problem, the eff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/23G06F113/16G06F119/02
CPCG06F30/23G06F2113/16G06F2119/02
Inventor 安荣曹昌铭刘威郑振王春青
Owner HARBIN INST OF TECH