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The method of judging whether the film of the grinding head is distorted

A technology of grinding head and film, applied in grinding machine tools, grinding devices, and parts of grinding machine tools, etc., can solve problems such as film dislocation and distortion, poor film uniformity on wafers, and reduced wafer yield.

Active Publication Date: 2021-11-26
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the limitation of the structure of the polishing head, when the gasket in the polishing head ages, the adhesive film will be misaligned and twisted between the central grinding area and the adjacent grinding area, which further leads to the unevenness of the film on the wafer after chemical mechanical polishing. Good, lower wafer yield
Moreover, the detection system of the existing grinding equipment can only characterize the grinding rate (RR) of the grinding head and the uniformity of the thin film on the wafer, and the defects of dislocation and distortion of the adhesive film between the central grinding area and the adjacent grinding area cannot be effectively detected arrive

Method used

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  • The method of judging whether the film of the grinding head is distorted
  • The method of judging whether the film of the grinding head is distorted
  • The method of judging whether the film of the grinding head is distorted

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Embodiment Construction

[0032] The specific implementation manner of the present invention will be described in more detail below with reference to schematic diagrams. The advantages and features of the present invention will be more apparent from the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0033] figure 1 It is the first schematic diagram of the grinding head in the embodiment of the present invention. Such as figure 1 As shown, the grinding head 100 includes a base 110 , a fixing ring 112 , a first adhesive film 120 and a second adhesive film 130 . A buckle 111 is disposed on the base 110 , the shape of the buckle 111 is cylindrical, and the buckle 111 is used to hold the wafer 200 during grinding. The inner diameter of the retaining ring 111 should be larger than the diameter of the wafer 200, ...

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Abstract

The invention provides a method for judging whether the adhesive film of a grinding head is twisted. The grinding head includes a first grinding area and a plurality of second grinding areas surrounding the first grinding area. The first grinding area is circular, and the second grinding area It is a concentric ring, and the area at the junction of the first grinding area and the adjacent second grinding area is an adjacent area, including: obtaining the grinding rate of the first grinding area and the grinding rate of the adjacent area; The difference between the grinding rate of the grinding rate and the grinding rate of the adjacent domain is compared with the set value to judge whether the rubber film of the grinding head is distorted. The method for judging whether the adhesive film of the grinding head is twisted or not uses the grinding rate of the first grinding area and the grinding rate of the adjacent area to be calculated and processed to determine whether the adhesive film of the grinding head is twisted. There is no need to upgrade the equipment, and it can effectively judge whether the rubber film of the grinding head is distorted.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for judging whether the adhesive film of a grinding head is twisted. Background technique [0002] Chemical Mechanical Polish (CMP) is a process that works together through a chemical reaction process and a mechanical polishing process. Generally, during the chemical mechanical polishing process, the polishing head exerts a certain pressure on the backside of the wafer, so that the front side of the wafer is close to the polishing pad. At the same time, the rotation of the grinding head drives the wafer and the grinding pad to rotate in the same direction, causing mechanical friction between the front of the wafer and the grinding pad. During the grinding process, a series of complex mechanical and chemical actions are used to grind the film on the surface of the wafer, so as to achieve the purpose of flattening the surface of the wafer. [0003] Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/005B24B49/00
CPCB24B37/005B24B49/006
Inventor 古峰
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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