Differential line wiring structure and differential line wiring structure generation method

Abstract

The invention discloses a differential line wiring structure. The differential line wiring structure comprises two differential lines which are distributed in parallel, and an avoiding groove used foravoiding a connector anti-bonding pad is formed in the portion, corresponding to the connector anti-bonding pad, of each differential line. It can be known that the differential lines in the differential line wiring structure are provided with receding grooves, the avoiding grooves are formed in the portion, close to the connector anti-bonding pad, of the differential lines, so that the connectoranti-bonding pads are avoided through the avoiding grooves, crosstalk increase caused by the fact that the differential lines are too close to a via hole is avoided, meanwhile, impedance discontinuity caused by the fact that the differential lines cross the connector anti-bonding pads is avoided, the signal transmission quality is improved, and the product reliability is improved. The invention further discloses a generation method of the differential line wiring structure of the connector area. The above technical effects can also be achieved.

Description

technical field [0001] The present invention relates to the technical field of differential wiring, and more specifically, to a differential wiring structure and a method for generating the differential wiring structure. Background technique [0002] With the increasing demand for high-speed and high-density storage servers, high-speed connectors and differential lines are often used on PCBs (Printed Circuit Boards). However, the current high-speed connectors are small in size and high in density, which reduces the routing of differential lines line space, presenting challenges for impedance control of differential lines; see figure 1 , is a typical wiring diagram of the differential line in the local area of ​​the connector in the existing scheme; through figure 1 It can be seen that in order to ensure the impedance design requirements, it is necessary to set the width of the differential line to W and the line pitch to P; at the same time, the antipad (anti-pad) area of ​...

AI Technical Summary

Problems solved by technology

[0002] With the increasing demand for high-speed and high-density storage servers, high-speed connectors and differential lines are often used on PCBs (Printed Circuit Boards). However, the current high-speed connectors are small in size and high in density, which reduces the routing of differential lines line space, presenting challenges for impedance control of differential lines; see figure 1 , is a typical wiring diagram of the differential line in the local area of ​​the connector in the existing scheme; through figure 1 It can be seen that in order to ensure the impedance design requirements, it is necessary to set the width of the differential line to W and the line pitch to P; at the same time, the antipad (anti-pad) area of ​​the differential via hole of the connector is hollowed out; due to the space in the connector area Limitation, when the differential line enters the connector area from the normal wiring area, the crosstalk will increase because the differential line is too close to the via hole, and the differential line will cross the elliptical hollow area, resulting in impedance discontinuity

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