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Flexible substrate and method for producing same

A production method and flexible substrate technology, applied in the direction of circuit optical components, printed circuits, printed circuit components, etc., can solve the problems of low production efficiency of FPC and achieve the effect of improving production efficiency

Pending Publication Date: 2020-12-04
HUBEI AOMA ELECTRONICS TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide a flexible substrate and its production method, aiming to solve the technical problem in the prior art that each piece of flexible substrate unit needs to be subjected to light-shielding treatment after slitting, resulting in low production efficiency of FPC

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  • Flexible substrate and method for producing same
  • Flexible substrate and method for producing same

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0027] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain each If the relative positional relationship, movement conditions, etc. between the components change, the directional indication will also change accordingly.

[0028] In addition, the descriptions involving "first", "second" and so on in the present invention are only for d...

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Abstract

The invention discloses a flexible substrate and a production method thereof. The production method comprises the following steps: arranging a shading layer on a first surface of an insulating layer;arranging a bonding layer on the second surface, back to the first surface, of the insulating layer; and arranging a conductive layer on one surface, back to the insulating layer, of the bonding layer, so that the conductive layer, the bonding layer, the insulating layer and the shading layer are sequentially stacked from top to bottom, and the flexible substrate is formed. Due to the fact that the flexible substrate is directly integrated with the shading layer, shading treatment does not need to be conducted on slit flexible substrate units, the next process can be directly conducted on theflexible substrate integrated with the shading layer, and therefore the production efficiency of the FPC is remarkably improved.

Description

technical field [0001] The invention relates to the technical field of printed circuits, in particular to a flexible substrate and a production method thereof. Background technique [0002] With the rapid development of consumer electronics products, there are more and more requirements for materials. Based on the special requirements of backlight products, FPC (flexible printed circuit board) needs to meet the requirements of complete opacity under strong LED light. [0003] FPC is processed by flexible substrate units of preset size. Traditional flexible substrates do not have light-shielding properties. Therefore, after cutting the flexible substrate into flexible substrate units of preset sizes, it is necessary to In order to meet the light-shielding performance requirements of FPC, each piece of flexible substrate unit needs shading treatment, resulting in low production efficiency of FPC. Contents of the invention [0004] The main purpose of the present invention i...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K1/02
CPCH05K3/00H05K1/0274H05K1/028
Inventor 周芳杨海滨张良宝李卫南
Owner HUBEI AOMA ELECTRONICS TECH
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