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Edge material removing device

A technology of side material and adsorption part, which is applied in glass cutting devices, optics, glass manufacturing equipment, etc., can solve problems such as damage to the end of the substrate, and achieve the effect of preventing interference and preventing damage

Inactive Publication Date: 2020-12-18
TOP ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, according to this process, there is a problem that, in the process of returning to the original state after the jig is rotated to bend the end portion, interference occurs between the trim and the end portion of the substrate, friction under this interference, Damage to the edge of the substrate due to sliding, etc.

Method used

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Examples

Experimental program
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Embodiment Construction

[0026] Hereinafter, a scrap removal device according to an embodiment of the present invention will be described with reference to the drawings.

[0027] First, a substrate cutting device provided with a scrap removing device according to an embodiment of the present invention will be described. An object to be cut by the substrate cutting device may be a bonded substrate constituted by bonding the first panel and the second panel. For example, the first panel may include thin film transistors, and the second panel may include color filters. On the contrary, the first panel may include color filters, and the second panel may include thin film transistors. In the figure, the first panel is located at the top and the second panel is located at the bottom, but the present invention is not limited to the orientation of the first panel and the second panel.

[0028] Hereinafter, the bonded substrate is simply referred to as a substrate. Furthermore, the surface exposed to the ou...

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PUM

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Abstract

An edge material removing device according to an embodiment of the present invention is used to remove an edge material delimited by a scribe line formed at an end portion of a first panel of a substrate formed by adhering the first panel and a second panel, and may comprise: a first adsorption portion configured to adsorb the edge material; a second adsorption portion configured to adsorb an endportion of the second panel; and a rotating mechanism that rotates the first adsorption portion and the second adsorption portion so that the end of the substrate is bent and the edge material is broken along the scribe line, the edge material is adsorbed to the first adsorption part and the end of the second panel is adsorbed to the second adsorption part. In a manner that the end of the substrate is bent, the first adsorption portion and the second adsorption portion rotates, the first adsorption portion is separated from the second adsorption portion, and the edge material is separated fromthe substrate.

Description

technical field [0001] The present invention relates to a scrap removing device which is installed in a substrate cutting device for cutting a substrate and which removes scrap from the end of the substrate in order to form a stepped portion at the end of the substrate. Background technique [0002] In general, brittle mother glass panels such as glass (hereinafter referred to as A unit glass panel (hereinafter referred to as a "unit substrate") cut into a predetermined size. [0003] The process of cutting the substrate into unit substrates includes moving the scribing wheel and / or the substrate along the cutting plan line of the substrate to be cut while pressing the scribing wheel made of a material such as diamond against the substrate to form a scribe line. Scribing process. [0004] The substrate is formed by bonding the first panel and the second panel, and depending on design conditions of the substrate, it may be necessary to perform a process of forming a stepped...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/07
CPCC03B33/07G02F1/133351G02F1/1303
Inventor 张喜童郑在晳
Owner TOP ENG CO LTD