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Substrate transfer head

A transfer head and substrate technology, applied in the manufacture of conveyor objects, electrical components, semiconductor/solid-state devices, etc., can solve problems such as residual adhesion status, and achieve the effect of easy and reliable separation

Pending Publication Date: 2020-12-18
TOP ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This scrap should be separated from the unit substrate, but it may remain on the edge of the unit substrate in an attached state due to various reasons

Method used

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  • Substrate transfer head
  • Substrate transfer head
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Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0032] Hereinafter, a substrate transfer head according to an embodiment of the present invention will be described with reference to the drawings.

[0033] First, refer to Figure 1 to Figure 2 , the substrate cutting apparatus provided with the substrate transfer head according to the first embodiment of the present invention will be described.

[0034] refer to figure 1 and figure 2 , the direction of transferring the mother substrate S to be subjected to the substrate cutting process is defined as the Y-axis direction, and the direction intersecting the direction of transferring the mother substrate S (Y-axis direction) is defined as the X-axis direction. Also, the direction perpendicular to the X-Y plane on which the mother substrate S is placed is defined as the Z-axis direction. In addition, the term scribe line means a groove and / or a crack formed on the surface of the motherboard S so as to extend in a predetermined direction. In addition, the term "cutting plan ...

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PUM

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Abstract

A substrate transfer head according to an embodiment of the present invention comprises: an adsorption member configured to adsorb a unit substrate divided from a mother substrate; a first rim chargepressing portion including: a plurality of push rods arranged to correspond to a region occupied by rim charges located around the unit substrate; a push plate, which is provided with a plurality of push rods; and a push plate driver that moves the push plate so that the plurality of push rods pressurize the rim charges; and a second rim charge pressurizing unit including: a gas spray nozzle configured to spray a gas toward an edge portion of the unit substrate to pressurize the rim charge; and a gas supply source configured to supply a gas to the gas spray nozzle, and either the first rim charge pressurizing unit or the second rim charge pressurizing unit may be configured to pressurize the rim charge before or when the unit substrate is adsorbed by the adsorption member, or when the unitsubstrate is adsorbed by the adsorption member. The other of the first rim charge pressing portion and the second rim charge pressing portion is configured to press the rim charge remaining at the edge of the unit substrate adsorbed to the adsorption member.

Description

technical field [0001] The present invention relates to a substrate transfer head configured to transfer unit substrates divided from a mother substrate. Background technique [0002] In general, various kinds of panels, semiconductor substrates, and the like for displays are manufactured using unit substrates cut into predetermined sizes from mother substrates made of brittle materials. [0003] In order to cut the mother substrate into unit substrates, a scribing process is performed, that is, a scribing wheel made of a material such as diamond is pressed on the mother substrate, and the scribing wheel is moved along a virtual cutting plan line where the mother substrate is to be cut. Scribing lines are formed on the mother substrate. Also, a breaking process of pressing the mother substrate along the scribe lines is performed, thereby dividing the mother substrate into unit substrates. Afterwards, a substrate transfer process is performed, that is, the unit substrates s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/67703H01L21/67092H01L21/67712H01L21/67017H01L21/67259H01L21/67248
Inventor 朴鲁贤
Owner TOP ENG CO LTD