Rapid colloid injection device for manufacturing photodiode
A photodiode and injection device technology, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems such as delay in processing time, low efficiency of glue injection, and inability to guarantee the verticality of the glue, so as to speed up the molding speed.
Inactive Publication Date: 2021-01-29
粤融(广州)科技有限公司
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Problems solved by technology
[0003] When injecting glue, the colloid generally needs to be fixed into a fixed shape. It cannot guarantee the vertical shape of the colloid after molding, and at the same time, it cannot quickly and effectively inject the glue, and the efficiency of the glue injection is low. It is not conducive to the subsequent operation steps and delays the processing time. Therefore, in view of this, the existing structure and defects are studied and improved, and a colloid rapid injection device for photodiode manufacturing is provided in order to achieve more practical value.
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Embodiment Construction
[0020] The present invention will be further described below in conjunction with accompanying drawing:
[0021] The invention provides a colloid rapid injection device for photodiode manufacturing, as attached figure 1 to attach Figure 5 Shown: Including the glue injection chamber 1, the inner rotation of the glue injection chamber 1 is installed with the disc 2, the disc 2 is fixedly installed on the output end of the motor, the surface of the disc 2 is movable and installed with the adjustment frame 3, and the inner part of the adjustment frame 3 A sector gear 4 is fixedly installed at the end, and the sector gear 4 is rotatably installed inside the glue injection chamber 1, and the inner surface of the sector gear 4 is meshed with a movable plate 5, and the connection between the disc 2 and the adjustment frame 3 is provided with a corresponding protrusion. Column and chute, the outer surface of the movable plate 5 is provided with a tooth block corresponding to the secto...
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The invention provides a rapid colloid injection device for manufacturing aphotodiode. The top end of a supporting rod is movably installed at the bottom of an adjusting frame, the tail end of the supporting rod is fixedly installed at the outer end of a bottom frame, the top end of the bottom frame is fixedly installed on the lower surface of a die holder, and a sliding block is attached to the bottom end of the bottom frame; and the outer surface of the sliding block is fixedly connected with a compression spring, a push plate is attached to the inner end of the sliding block, a rubber storage bag is arranged on the surface of the inner side of the push plate, and the rubber storage bag is fixedly connected with the mold base through a connecting pipe. When a movable plate moves downwards, the outer end of the adjusting frame is upward to drive the bottom frame at the bottom end of the supporting rod to move upwards, and when the bottom frame moves to the top end, after the colloid mold cover coincides with the mold base and the bottom end of the bottom frame is separated from an inclined groove of the sliding block, the sliding block and the pushing plate are pushed through thepushing force of the compression spring to extrude the storage capsule into the glue groove for glue injection to form glue; and the surface of the glue obtained after glue injection molding is located on the same horizontal line, and meanwhile rapid glue injection can be achieved.
Description
technical field [0001] The invention belongs to the technical field of photodiode manufacturing, in particular to a colloid rapid injection device for photodiode manufacturing. Background technique [0002] A photodiode is a semiconductor device that converts light signals into electrical signals, and converts the light energy irradiated to the semiconductor into electrical signals by releasing conductive carriers. It is often used to detect weak light signals. Photodiodes are the same as ordinary diodes. , in the manufacturing process, it is generally necessary to fix the colloid on the outer surface of the chip to make it a fixed shape. [0003] When injecting glue, the colloid generally needs to be fixed into a fixed shape. It cannot guarantee the vertical shape of the colloid after molding, and at the same time, it cannot quickly and effectively inject the glue, and the efficiency of the glue injection is low. It is not conducive to the subsequent operation steps and de...
Claims
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IPC IPC(8): H01L31/0203H01L21/56
CPCH01L21/56H01L31/0203
Inventor 张月荣
Owner 粤融(广州)科技有限公司