Blind buried hole circuit board processing technology
A processing technology and circuit board technology, applied in the directions of printed circuit, multilayer circuit manufacturing, printed circuit manufacturing, etc., can solve the problems of scrapping, troublesome use, and scratching of circuit boards with blind and buried holes, and increase the quality of circuit boards. , easy to use effect
Pending Publication Date: 2021-01-29
SHENZHEN CHANGDONGXIN PCB CO LTD
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Problems solved by technology
[0003] However, the existing blind-buried circuit board processing technology has certain shortcomings that need to be improved in the process. First, there is no fool-proof setting after cutting, because the blind-buried circuit board needs buried holes, so the multi-layer blank During the step-by-step pressing, if the direction of the two blanks is misplaced, it will lead to the scrapping of the entire circuit board with blind buried holes. In traditional processing, it needs to be carried out by instruments. Observing the surface pattern of the blank is quite troublesome to use; secondly, in the process of processing, adjacent circuit boards tend to scratch each other, which reduces the quality of blind buried circuit boards, and scratches also affect later circuits The working stability of the board is poor in practicability
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[0033] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0034] Such as Figure 1-2 As shown, the blind buried hole circuit board processing technology, the process specifically includes the following steps:
[0035] Step 1: cutting, cutting the blank according to the size of the first layer board, the second layer board, the third layer board, the fourth layer board, the fifth layer board and the sixth layer board to obtain the first layer board, The blanks of the second ply, the third ply, the fourth ply, the fifth ply and the sixth ply;
[0036] Step 2: Set the fool-proof, set the fool-proof openings at the corners of the blanks of the first layer, the second layer, the third layer, the fourth layer, the fifth layer and the sixth layer respectively 1. Fool-proof Port two, anti-fool three, anti-fool...
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Abstract
The invention discloses a blind buried hole circuit board processing technology, which specifically comprises the following steps of: cutting, specifically, cutting a blank according to the sizes of afirst layer plate, a second layer plate, a third layer plate, a fourth layer plate, a fifth layer plate and a sixth layer plate to obtain the blanks of the first layer plate, the second layer plate,the third layer plate, the fourth layer plate, the fifth layer plate and the sixth layer plate; and setting fool-proof units, namely, forming a first fool-proof opening, a second fool-proof opening, athird fool-proof opening, a fourth fool-proof opening and a fifth fool-proof opening in the corner positions of the blanks of the first layer plate, the second layer plate, the third layer plate, thefourth layer plate, the fifth layer and the sixth layer plate respectively. According to the blind buried hole circuit board processing technology, the industrial fool-proof process is added, it is guaranteed that each layer board and the core board can be pressed at the standard position, no external instrument needs to be used for judgment, use is more convenient, the quality of the circuit board is improved, and the working stability of the blind buried hole circuit board after being manufactured is facilitated.
Description
technical field [0001] The invention relates to the field of blind and buried hole circuit boards, in particular to a processing technology for blind and buried hole circuit boards. Background technique [0002] Blind buried hole circuit board is a conventional multi-layer circuit board structure used in high-end products such as mobile phones and GPS navigation. Optimized manufacturing process to realize the connection function between the internal circuits of each layer; [0003] However, the existing blind-buried circuit board processing technology has certain shortcomings that need to be improved in the process. First, there is no fool-proof setting after cutting, because the blind-buried circuit board needs buried holes, so the multi-layer blank During the step-by-step pressing, if the direction of the two blanks is misplaced, it will lead to the scrapping of the entire circuit board with blind buried holes. In traditional processing, it needs to be carried out by inst...
Claims
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Login to View More IPC IPC(8): H05K3/46
CPCH05K3/4611H05K3/4638
Inventor 班万平刘宝涛
Owner SHENZHEN CHANGDONGXIN PCB CO LTD