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A liquid-cooled heat-absorbing block that is easy to expand and connect

A heat-absorbing block and liquid-cooling technology, used in cooling/ventilation/heating renovation, electrical components, electrical equipment structural parts, etc. problem, to achieve the effect of convenient and easy locking

Active Publication Date: 2021-09-21
APALTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, although a general liquid-cooled heat-absorbing block has multiple liquid outlets for connection, they are usually in the same direction, and there are restrictions on the connection of multiple liquid-cooled heat-absorbing blocks, and when the infusion tube needs to cross the For other liquid-cooled heat-absorbing blocks, the infusion tube can only be bent and bypassed, which will not only increase the occupied space and affect the overall layout, but also hinder the flow of working fluid in the infusion tube and reduce the size of the liquid-cooled heat-absorbing block. cycle efficiency

Method used

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  • A liquid-cooled heat-absorbing block that is easy to expand and connect
  • A liquid-cooled heat-absorbing block that is easy to expand and connect
  • A liquid-cooled heat-absorbing block that is easy to expand and connect

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Embodiment Construction

[0039] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

[0040] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude one or more other Presence or addition of characteristics, wholes, steps, operations, elements, components and / or collections.

[0041]In order t...

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Abstract

The invention relates to a liquid-cooled heat-absorbing block that is easy to expand and connect. It includes an upper shell assembly and a heat-absorbing seat. The upper shell assembly includes an upper shell. block, the front end of the long strip bump is provided with a liquid inlet, and the left and right sides of the long strip bump are respectively provided with a liquid outlet, and the upper shell has an inner cavity connected to each liquid outlet, and the upper shell assembly is fixed on the heat absorbing On the seat, the heat-absorbing seat has a storage tank, and a plurality of heat dissipation fins are arranged in the storage tank, and the liquid inlet is connected with the inner chamber through the storage tank; thereby, liquid outlets in different directions can be used according to requirements to connect to the Diverse connection configurations for liquid-cooled heat sinks.

Description

technical field [0001] The invention relates to a liquid-cooled heat-absorbing block, in particular to a liquid-cooled heat-absorbing block which is easy to expand and connect. Background technique [0002] With the advancement of technology, the functions of 3C products and servers and other devices are becoming more and more diverse, and the operating performance is getting higher and higher, so that the internal electronic components generate more heat. Therefore, most electronic components need to use The heat dissipation device is used to dissipate heat to avoid the high temperature of electronic components from affecting the performance and stability of operation. In recent years, liquid cooling devices have been widely used in heat dissipation devices. The principle is to use the circular flow of liquid to convert The heat generated by the electronic components is transferred to the cooling element, which then dissipates the heat. [0003] However, although a general...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20272
Inventor 肖启能陈敏锐
Owner APALTEK CO LTD