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Protection layer for panel handling systems

A technology of protective layer and panel, applied in electrical equipment shell/cabinet/drawer, semiconductor/solid-state device components, semiconductor/solid-state device testing/measurement, etc., can solve the problem of different manipulation and processing

Active Publication Date: 2021-02-09
AT & S AUSTRIA TECH & SYSTTECHN AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Challenges arise when some of the well-established and standardized technologies for wafer processing are transferred to panel processing because the handling and handling of wafers is substantially different from that of panels

Method used

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  • Protection layer for panel handling systems
  • Protection layer for panel handling systems
  • Protection layer for panel handling systems

Examples

Experimental program
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Embodiment Construction

[0074] The illustrations in the figures are schematic. It is to be noted that in different figures, similar or identical elements or features are denoted by the same reference numerals or reference numerals which differ from the corresponding reference numerals only within the first digit. In order to avoid unnecessary repetition, elements or features which have already been clarified with respect to the previously described embodiments may not be clarified at a later point in the description.

[0075] Additionally, spatially relative terms such as "front" and "rear," "upper" and "lower," "left" and "right," etc., are used to describe one element's relationship to another as shown in the figures. Accordingly, spatially relative terms may apply to an orientation in use that differs from the orientation depicted in the figures. Obviously, all such spatially relative terms refer to the orientations shown in the drawings for ease of description only and are not necessarily limiti...

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PUM

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Abstract

An arrangement 100 comprises a panel 110 configured as a pre-form for manufacturing a plurality of component carriers; a protection layer 113 covering a surface portion 114 of a main surface 111 of the panel 110, wherein the protection layer 113 is detachable from the surface portion 114 without leaving residues on the panel 110; and a handling tool 120 for handling the panel 110, wherein the handling tool 120 comprises a handling tool handling surface 121 onto which the panel 110 is arrangeable; wherein the panel 110 comprises a panel handling surface 112, with which the panel 110 is arrangeable onto the handling tool 120, wherein the panel handling surface 112 comprises at least part of the surface portion 114 covered by the protection layer 113.

Description

technical field [0001] Various embodiments relate to a handling device and a corresponding method for handling a panel configured as a preform for producing a plurality of component carriers. Background technique [0002] Wafer handling involves many mature and standardized technologies, such as those used to transfer wafers between different production machines or tools in the manufacturing process. For this transfer, storage devices such as Front Opening Pods (FOUPs), such as cassettes, cassettes and all Type of product carrier. Wafers in the FOUP are entered through the front pod door. The cassette door interfaces with the tool load port from which wafers are loaded into or removed from the FOUP and into or out of a different production tool. [0003] In recent years, in terms of panel level packaging (PLP), various processing steps have been increasingly implemented. Think of this development as the fusion of embedded chip technology at the printed wiring board (PWB)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K7/18H01L21/66
CPCH05K7/18H05K5/0217H05K5/0243H01L22/12H01L21/67092H01L21/6838H01L21/67028H01L21/67742H01L23/3121H01L23/32H01L23/49811
Inventor 马库斯·莱特格布马尔科·加瓦宁海因茨·哈本巴赫
Owner AT & S AUSTRIA TECH & SYSTTECHN AG