Sonic cleaning device and wafer cleaning equipment
A technology for sonic cleaning and cleaning equipment, applied in cleaning methods and utensils, cleaning methods using liquids, fluids using vibration, etc., and can solve the problem that wafer surface cleaning devices cannot remove particles of different sizes.
Active Publication Date: 2022-02-22
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF8 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] The first object of the present invention is to provide an acoustic wave cleaning device to solve the technical problem that existing wafer surface cleaning devices cannot remove particle pollutants of different sizes
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0037] In order to make the above objects, features and advantages of the present invention more comprehensible, specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0038] figure 1 A schematic top view of a partial structure of the wafer cleaning equipment provided in this embodiment. Such as figure 1 As shown, this embodiment provides a wafer cleaning device, including a sonic cleaning device, specifically, the sonic cleaning device includes a transducer 010, and the transducer 010 is installed on a mechanical arm 020, and the sonic cleaning device passes through the transducer 010 implements cleaning of the wafer 030 .
[0039] By installing a sonic cleaning device in the wafer cleaning equipment, efficient cleaning of the wafer 030 can be achiev...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides an acoustic wave cleaning device and wafer cleaning equipment, relates to the field of semiconductor integrated circuit processing and cleaning equipment, and is designed to solve the problem that existing wafer surface cleaning devices cannot remove particle pollutants of different sizes. The acoustic wave cleaning device is used for wafer cleaning equipment, and includes a transducer, the transducer includes a vibrator, a conductive part and a vibrating part, the vibrator is connected to the vibrating part through the conductive part, the vibrator includes a plurality of sub-vibrators, and the multiple sub-vibrators have at least two types With different natural frequencies, the vibrating element includes a plurality of vibrating regions, which are arranged in one-to-one correspondence with a plurality of sub-oscillators, and the plurality of vibrating regions include at least one planar vibrating region and at least one micro-resonant cavity vibrating region. The wafer cleaning equipment includes the above-mentioned acoustic wave cleaning device. The acoustic wave cleaning device and wafer cleaning equipment provided by the present invention can efficiently remove particle pollutants of different sizes.
Description
technical field [0001] The invention relates to the field of processing and cleaning equipment for semiconductor integrated circuits, in particular to an acoustic wave cleaning device and wafer cleaning equipment. Background technique [0002] As the feature size of integrated circuits enters the deep submicron stage, the requirements for cleaning processes in the manufacturing process of integrated circuit chips are also getting higher and higher. Chemical etching emphasizes good selectivity for different materials and different geometric directions. In general, wet chemical etching has isotropic characteristics for the same material, so it is difficult to meet the requirements of selective etching and plasma dry etching. After etching, the organic photoresist residue attached to the sidewall and bottom of the characteristic dimension is cleaned and removed under the condition of no or little etching in the width direction of the characteristic dimension. During the cleani...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): B08B3/12B06B1/06H01L21/67
CPCB08B3/12B06B1/0625H01L21/6704
Inventor 杨慧毓吴仪许璐
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD