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Polishing device

A polishing device and polishing head technology, which can be used in grinding devices, grinding machine tools, metal processing equipment, etc., can solve the problem of difficulty in ensuring the consistency of the polishing process of two or more wafers

Active Publication Date: 2021-02-26
HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the existing wafer polishing device, although one polishing head corresponding to two polishing heads can improve the polishing efficiency, it is difficult to ensure the consistency of the polishing process of two or more wafers. high industry

Method used

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0031] Please refer to Figure 1 to Figure 6 , figure 1 Schematic diagram of the structure of the polishing device provided by the present invention; figure 2 for figure 1 Side view of the polishing device in th...

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Abstract

The invention discloses a polishing device. The polishing device comprises a base, wherein the base is provided with a polishing head seat; the polishing head seat is provided with two polishing headsfor fixing wafers and a linear driving mechanism which is located between the two polishing heads and is used for driving the two polishing heads to move. In a polishing process, the base is locatedabove a polishing platform; the polishing heads drive the wafers to rotate; meanwhile, the linear driving mechanism drives the two wafers to do linear translation sweeping at the same time. The polishing liquid is more uniformly distributed by linear sweeping; and meanwhile, a polishing pad is more uniformly abraded so that the polishing consistency of the two wafers can be remarkably improved. The polishing of the wafers of the same batch is the same, so that the quality stability of a product is guaranteed and steps of detecting the quality of the product in a subsequent treatment process are simplified.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing equipment, in particular to a polishing device. Background technique [0002] During the wafer production process, chemical planarization and polishing are required to make the surface of the wafer reach a qualified flatness and smoothness. During the chemical planarization polishing process, the polishing pad, polishing head, polishing liquid, polishing pad dresser, motion trajectory, and force all affect the final flatness and smoothness of the wafer. How to ensure the quality and yield of polished wafers at the same time is one of the main research directions in the field of wafer processing. [0003] The existing mainstream wafer polishing device includes a polishing table and a corresponding polishing head. The polishing table has one degree of freedom in rotation, the polishing head has two degrees of freedom (rotation and sweeping on the polishing head table), and three de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/07B24B37/34
CPCB24B37/07B24B37/34
Inventor 杨渊思徐枭宇周智鹏
Owner HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
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