A cleaning device for electroplating copper ball treatment

Abstract

The invention discloses a cleaning device for electroplating copper balls, which comprises a device main body, a cover body is arranged on the top of the device body, an air valve is arranged at the center of the upper end of the cover body, three sets of legs are arranged at the bottom of the device body, three sets of legs A connecting frame is set up between the legs, and a hydraulic cylinder is installed on the upper end of the connecting frame between the legs, and a hydraulic rod is installed inside the hydraulic cylinder. There is a filter device at the bottom of the tank, a liquid inlet pipe is provided on one side of the upper end of the cleaning tank, and a liquid outlet pipe is provided on the other side of the bottom of the cleaning tank. A discharge port is provided; this kind of cleaning equipment for electroplating copper balls is equipped with a stirring device, and the stirring paddle is spirally attached to the upper end of the rotating shaft, which can better drive the solution to rotate in a spiral shape, so that the copper balls can be more in contact with the solution. Adequate contact prompts the cleaning efficiency of the device.

Description

technical field [0001] The invention relates to the technical field of copper plating cylinder maintenance, in particular to a cleaning device for electroplating copper balls. Background technique [0002] In the field of electroplating, the maintenance of the copper plating cylinder needs to replace the potion, clean the copper ball, anode bag, titanium mesh, etc., especially the copper ball maintenance uses the micro-etching solution configured with hydrogen peroxide and sulfuric acid to remove the anode film. Do copper ball cleaning equipment for this. [0003] There are following defects or problems in the prior art: [0004] 1. The existing cleaning machine has a general filtering effect and cannot isolate copper balls from the solution while filtering small copper balls that do not meet the specifications; [0005] 2. The existing cleaning machine is highly corrosive because the solution is mostly mixed with hydrogen peroxide and sulfuric acid, and the service life o...

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a cleaning device for electroplating copper balls to solve the problems in the background technology that the filtering effect is general and it is impossible to isolate the copper balls from the solution while filtering. The small copper balls that meet the specifications are mostly corrosive because the solution is mixed with hydrogen peroxide and sulfuric acid. The service life of the internal components is short, the copper balls cannot fully contact the solution, and the cleaning efficiency is low. The contact of the solution produces a chemical reaction, the safety of the staff cannot be guaranteed, and the internal components cannot be operated and cannot be detected at the first time, etc.

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