Semiconductor package structure

Abstract

The invention discloses a semiconductor package structure, including a substrate having a first surface and an opposite second surface, where the substrate includes a wiring structure; a first semiconductor die disposed on the first surface of the substrate and electrically coupled to the wiring structure; a second semiconductor die disposed on the first surface and electrically connected to the wiring structure, in which the first semiconductor die and the second semiconductor die are arranged side by side; a molding compound surrounding the first semiconductor die and the second semiconductor die, where the first semiconductor die is separated from the second semiconductor die by the molding compound; and an annular frame mounted on the first surface of the substrate, where the annular frame surrounds the first semiconductor die and the second semiconductor die, where the annular frame includes a constricted region at an outer corner of the annular frame. Thus, warping at corners ofthe substrate is eliminated or reduced when a frame having a wider width is used.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor packaging structure. Background technique [0002] The semiconductor package can not only protect the semiconductor die from environmental pollutants, but also provide electrical connection between the semiconductor die packaged in the semiconductor package and a substrate (such as a printed circuit board (PCB, printed circuit board)). For example, semiconductor die may be encapsulated in an encapsulating material and electrically connected to the substrate with traces. [0003] However, a problem with such semiconductor packages is that the semiconductor packages are subjected to different temperatures during the packaging process. Due to the different coefficients of thermal expansion (CTE, coefficients of thermal expansion) of various substrates and semiconductor die materials, semiconductor packages may be subjected to high stress. As a result, warpin...

AI Technical Summary

Problems solved by technology

As a result, the semiconductor package may experience warping or cracking, which may damage the electrical connection between the semiconductor die and the substrate, and may reduce the reliability of the semiconductor package.

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