AI intelligent voice interaction recognition motion Bluetooth earphone module
A Bluetooth headset and intelligent voice technology, applied in the directions of earpieces/headphone accessories, on-ear/over-ear headphones, sensors, etc., can solve the problems such as the lack of heating function of Bluetooth headsets, ear damage, and the inability to meet the needs of Bluetooth headsets. , to protect the ears, increase comfort, and prevent offset
Pending Publication Date: 2021-03-12
深圳市中翔达润电子有限公司
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[0003] The purpose of the present invention is to provide an AI intelligent voice interactive recognition motion bluetooth earphone module, which has the advantage of heating and heat preservation, and solves the problem that the existing bluetooth earphones do not have a heating function, and wearing a bluetooth earphone will cause damage to the ears when the weather is cold, especially in In winter, it cannot meet people's needs for using Bluetooth headsets in winter
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[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0017] In the description of this document, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal" , "Top", "Bottom", "Inner", "Outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing this patent and simplifying the description, rather than indicating or ...
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The invention discloses an AI intelligent voice interaction recognition motion Bluetooth earphone module. The module comprises a clamping rod, connecting rods are arranged on the two sides of the clamping rod, mounting pipes are arranged at the bottoms of the connecting rods, mounting bases are fixedly mounted at the bottoms of the mounting pipes, and earmuffs are fixedly mounted on the sides, close to each other, of the mounting bases. Clamping rods are arranged to be used for installing and fixing the shock pads, the stability of the shock pads is improved, the shock pads are prevented fromfalling off, installing pipes are arranged to be used for installing and fixing the installing base, the stability of the installing base is improved, and the installing base is prevented from deviating in the using process; the earmuffs are arranged and used for improving the comfort of a user wearing the device, and meanwhile the problems that an existing Bluetooth headset does not have a heating function, ears are hurt when the user wears the Bluetooth headset in cold weather, and especially in winter, the use requirements of people for the Bluetooth headset in winter cannot be met are solved.
Description
technical field [0001] The invention relates to the technical field of bluetooth earphones, in particular to an AI intelligent voice interaction recognition sports bluetooth earphone module. Background technique [0002] Bluetooth headset is to apply Bluetooth technology to hands-free headsets, so that users can avoid annoying wires and talk easily in various ways. Since the advent of Bluetooth headsets, it has always been a good tool for mobile business people to improve efficiency. Existing bluetooth earphones do not have a heating function, and wearing bluetooth earphones will cause damage to the ears when the weather is cold, especially in winter, which cannot satisfy people's needs for using bluetooth earphones in winter. Contents of the invention [0003] The purpose of the present invention is to provide an AI intelligent voice interactive recognition motion bluetooth earphone module, which has the advantages of heating and heat preservation, and solves the problem ...
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IPC IPC(8): H04R1/10
CPCH04R1/10H04R1/1008H04R1/1091
Inventor 叶志南
Owner 深圳市中翔达润电子有限公司