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Workpiece taking and placing assembly

A technology for workpieces and components, applied in the field of workpiece pick-and-place components, can solve the problems of difficulty in determining the position of the workpiece, increase the maintenance cost of the cleaning machine, damage to the workpiece, etc., and achieve the effect of improving safety.

Active Publication Date: 2021-03-16
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]However, when the existing manipulator is used to transfer workpieces, it is often difficult to determine the position of the workpiece, the workpiece is damaged during the transfer process, etc., which increases the workload of the cleaning machine. Maintenance costs, affecting the production rhythm of the cleaning production line

Method used

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Experimental program
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Embodiment Construction

[0036] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0037] In order to identify whether the claw has successfully grabbed the workpiece, the existing manipulator usually includes a detection sensor. The detection sensor is set at the position where the claw contacts the workpiece lug (the position of the claw center). When the mechanical device drives the claw to lift, such as the hook If the claw is successfully hooked to the lug, the lug will press on the detection sensor and trigger it, and then it will be determined that the manipulator has successfully grabbed the workpiece.

[0038] However, the cleaning solution in the cleaning tank usually includes corrosive liquids such as hydrofluoric acid. When the hoo...

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Abstract

The invention provides a workpiece taking and placing assembly. The workpiece taking and placing assembly comprises a control device, a driving device and a grabbing structure. The control device cancontrol the driving device to drive the grabbing structure to move in the vertical direction and the horizontal direction. The driving device can send vertical load feedback information and horizontalload feedback information to the control device according to the load of the driving device in the vertical direction and the load of the driving device in the horizontal direction. The control device is used for controlling the driving device to drive the grabbing structure to perform taking and placing operation, and when the vertical load feedback information or the horizontal load feedback information exceeds the feedback information range corresponding to the current step, it is judged that the pick-and-place operation is abnormal. According to the workpiece taking and placing assembly,the control device can discover abnormality in time according to the stress conditions of the grabbing structure and the driving device, so that the safety of a semiconductor process is improved.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a workpiece pick-and-place assembly for semiconductor equipment. Background technique [0002] In the production process of semiconductor cleaning machines, it is necessary to grab the workpieces stored in the cleaning solution by the manipulator, so as to realize the pick-and-place of the workpieces and the transfer of the workpieces between cleaning tanks. In the prior art, the manipulator usually includes a claw and a mechanical device for driving the claw to move. The mechanical device drives the claw to extend into the cleaning liquid and hook the hanging lug of the workpiece, thereby lifting the workpiece and removing it for cleaning. liquid. [0003] However, when the existing manipulator is used to transfer workpieces, it is often difficult to determine the position of the workpiece, and the workpiece is damaged during the transfer process, which increases the main...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/90B65G43/00
CPCB65G47/901B65G43/00
Inventor 宋俊超张虎威王广永王嗣阳
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD