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Method and apparatus for measuring erosion and calibrating position for a moving process kit

A process and kit technology, applied in the field of measuring erosion and calibrating positions and devices for mobile process kits, can solve problems such as expensive and process kit erosion

Pending Publication Date: 2021-03-16
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such tests are expensive and can take hours to complete
Also, the process kit may be eroded during the processing of the substrate

Method used

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  • Method and apparatus for measuring erosion and calibrating position for a moving process kit
  • Method and apparatus for measuring erosion and calibrating position for a moving process kit
  • Method and apparatus for measuring erosion and calibrating position for a moving process kit

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Embodiment Construction

[0023] Systems including sensor wafers with edge sensors and methods of using such sensor wafers to measure the positioning of a process kit relative to the sensor wafer are described in accordance with various embodiments. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent to those skilled in the art that the embodiments may be practiced without these specific details. In other instances, well known aspects have not been described in detail so as not to unnecessarily obscure the embodiments. Also, it is to be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0024] As noted above, to confirm that the process kit is properly positioned relative to the substrate, multiple substrates are processed in the processing tool to monitor etch rates and / or run particle tests. Only after many subst...

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PUM

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Abstract

Embodiments disclosed herein include a method of calibrating a processing chamber. In an embodiment, the method comprises placing a sensor wafer onto a support surface in the processing chamber, wherein a process kit displaceable in the Z-direction is positioned around the support surface. In an embodiment, the method further comprises measuring a first gap distance between the sensor wafer and the process kit with a sensor on an edge surface of the sensor wafer. In an embodiment, the method further comprises displacing the process kit in the Z-direction. In an embodiment, the method further comprises measuring an additional gap distance between the sensor wafer and the process kit.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Non-provisional Application No. 16 / 545,827, filed August 20, 2019, which claims the benefit of U.S. Provisional Application No. 62 / 726,892, filed September 4, 2018 , the entire contents of these US applications are hereby incorporated by reference herein. Background technique [0003] Embodiments relate to the field of semiconductor manufacturing, and in particular to methods and apparatus for measuring position and erosion of a moving process kit. Background technique [0004] In the processing of substrates, such as semiconductor wafers, the substrate is placed on a support surface (eg, an electrostatic chuck (ESC)) in a processing chamber. Generally, a process kit is placed around a support surface to provide desired processing characteristics during substrate processing. For example, process kits can be used to help shape the plasma in the plasma chamber to provide a more...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683H01L21/68H01L21/66
CPCH01L21/67259H01L21/681G01B7/14H01L21/67253G01D5/14
Inventor C·G·波特E·莫S·洛佩兹卡巴加尔
Owner APPLIED MATERIALS INC