System and method for characterization of buried defects

A defect and subsystem technology, applied in the field of defect inspection and classification, which can solve problems such as inability to accurately measure size and depth, detection and/or measurement difficulties, etc.

Active Publication Date: 2021-04-23
KLA TENCOR TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Detecting and / or measuring these defects can be very difficult, especially for defects in layers below the surface of the device
Current systems and methods may not be able to accurately measure the size and depth of these defects

Method used

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  • System and method for characterization of buried defects
  • System and method for characterization of buried defects
  • System and method for characterization of buried defects

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Embodiment Construction

[0016] The invention has been particularly shown and described with respect to particular embodiments and its particular features. The embodiments set forth herein are to be regarded as illustrative and not restrictive. It will be readily apparent to those skilled in the art that various changes and modifications in form and details can be made without departing from the spirit and scope of the invention.

[0017] Reference will now be made in detail to the disclosed subject matter illustrated in the accompanying drawings.

[0018] generally refer to Figures 1A to 6 , systems and methods for defect detection and classification using machine learning are shown and described in accordance with one or more embodiments of the invention.

[0019] Embodiments of the invention relate to defect detection and classification using machine learning classifiers (eg, defect classifiers). More specifically, embodiments of the invention relate to training a defect classifier using images...

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PUM

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Abstract

A system for defect detection and analysis is provided. The system may include an inspection sub-system and a controller including a memory and one or more processors. The inspection sub-system may include an illumination source and one or more detectors configured to acquire control patch images of defects of a control specimen along one or more detector channels. The one or more processors may be configured to train a defect classifier using the control patch images and known parameters associated with the defects of the control specimen. The inspection sub-system may be further configured to acquire patch images of identified defects on an additional specimen. The one or more processors may be configured to determine parameters of the identified defects using the defect classifier.

Description

[0001] Cross References to Related Applications [0002] This application asserts under 35 U.S.C. § 119(e) an inventor named Jason Kirkwood and Jan Lauber filed on September 19, 2018 entitled " DEPTH MEASUREMENT OF BURIED DEFECTS IN VNANDSTACKS USING DEEP-LEARNING," U.S. Provisional Application Serial No. 62 / 733,463, which is incorporated by reference in its entirety incorporated into this article. technical field [0003] The present disclosure relates generally to defect inspection and classification, and more particularly to the use of machine learning for defect inspection and classification. Background technique [0004] Fabrication of semiconductor devices, such as VNAND structures and semiconductor wafers, typically involves forming numerous thin films and insulating layers on top of a semiconductor substrate. During the manufacturing process, defects may arise in the manufacture of any of the various layers. Detecting and / or measuring these defects can be very di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/66G06V10/764
CPCG06T7/0004G06T2207/20081G06T2207/20084G06T2207/30148G06T7/62G06V2201/06G06V10/82G06V10/764H01L21/67288G06T2207/20212G06T2207/10024G06T7/50G06T7/60G06F18/24133G06F18/24G06F18/214H01L21/67242H01L22/34H01L22/12H01L22/24
Inventor J·柯克伍德J·劳贝尔
Owner KLA TENCOR TECH CORP
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