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Vapor chamber

A technology of soaking plate and pillar, applied in heat exchange equipment, indirect heat exchanger, lighting and heating equipment, etc., can solve problems such as warping of flat heat pipes

Active Publication Date: 2021-05-07
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the planar heat pipe described in Patent Document 1, the outer peripheral portion of the protrusion is sealed by laser welding, but the plate-shaped body is heated during laser welding, and there is a problem that the entire planar heat pipe warps.

Method used

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Examples

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Embodiment 3

[0147] In addition to changing the etching pattern of the second sheet to form not only the first pillar but also the second and third pillars, the first sheet and the second sheet were welded in the same order as in Comparative Example 1, and the and Figure 6 The vapor chamber 3 according to Example 3 has the second support and the third support at the same position.

[0148] The proportion of the length dimension of the second support in the longitudinal direction of the substantially rectangular shape and the ratio of the width dimension of the third support in the plan view shape of the vapor chamber, the width dimension of the second support and the width of the third support in the width direction of the generally rectangle Table 1 shows the ratio of the length dimension and the ratio of the area of ​​each of the second support and the third support to the area of ​​the case in plan view.

[0149] In addition, the height of the second pillar and the third pillar was 15...

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Abstract

A vapor chamber (1) comprising: a case (10) comprising a first sheet (11) and a second sheet (12) having an outer edge thereof bonded by heat; a hydraulic fluid (20) inside the case; a wick (30); and support columns (40). The support columns comprise: first support columns (41) for forming cavities (13) inside the case; and second support columns (42) for suppressing warping of the case caused by heating when bonding both sheets. In the planar view, the area per first support column is no more than 0.05% of the case and the area per second support column is 0.5%-7.0% of the case. The external shape of the vapor chamber is a combination of substantially rectangular shapes. The second support columns are provided at positions that pass through the center point (CT1), on the inside of the longest substantially rectangular shape (T1) in the longitudinal direction. The length (L2a) of the second support columns is 30%-70% of the length (LT1) of the longest substantially rectangular shape. The width (W2a) of the second support column is 5%-10% of the width (WT1) of the longest substantially rectangular shape.

Description

technical field [0001] This invention relates to vapor chambers. Background technique [0002] In recent years, in mobile terminals such as smartphones and tablet PCs, the amount of heat generated has increased due to higher integration and higher performance of components. In addition, as the miniaturization of products progresses, heat generation density increases, so heat dissipation measures become important. [0003] As a heat countermeasure member with a high heat dissipation capability, a vapor chamber which is a planar heat pipe can be mentioned. The overall apparent thermal conductivity of the vapor chamber is several to several tens of times higher than that of metals such as copper and aluminum. [0004] As a heat countermeasure component using a vapor chamber, for example, Patent Document 1 cites a planar heat pipe having a container and a working fluid, and the container is formed at the center by two opposing plate-shaped bodies. There is a convex portion ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02H01L23/427H05K7/20
CPCH05K7/20H01L23/427F28D15/0233F28D15/046F28F2240/00F28D15/0283F28D15/04
Inventor 小岛庆次郎沼本龙宏玉山孟明久米宗一
Owner MURATA MFG CO LTD