Processing method for blind slot of circuit board

A processing method and board blind technology, which is applied to printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of processing design graphics, inability to connect circuit layers, and circuit layer circuit connections of circuit boards.

Inactive Publication Date: 2021-05-18
珠海杰赛科技有限公司 +1
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  • Abstract
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Problems solved by technology

However, when the circuit board needs to be copper-plated and tin-plated during the production process, the bottom of the blind slot will also be plated with copper and tin, so that the metal at the bottom of the blind slot will cover the circuit layer of the circuit board, which cannot be applied to the circuit layer. Process the required design graphics, resulting in circuit connection problems on the circuit layer of the circuit board

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  • Processing method for blind slot of circuit board
  • Processing method for blind slot of circuit board
  • Processing method for blind slot of circuit board

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Embodiment Construction

[0020] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0021] see Figure 1 to Figure 3 , the processing method for the circuit board blind slot provided by this embodiment includes:

[0022] Step S1, milling grooves on the first substrate 1 and prepreg 3 to obtain blind grooves 5;

[0023] Step S2, stacking the first substrate 1, the prepreg 3 and the second substrate 2;

[0024] Step S3, placing the glue-resisting parts in the blind slot 5 for lamination;

[0025] Step S4, taking out the glue resisting piece, and performing copper plating and tin plating in sequence;

[0026] Step S5, performing laser ablation on the tin 6 located at the bottom o...

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Abstract

The invention provides a processing method for the blind slot of a circuit board; the method comprises the following steps: S1, carrying out slot milling on a first substrate and a prepreg to obtain a blind slot; S2, overlapping the first substrate, the prepreg and a second substrate; S3, placing a glue blocking piece in the blind groove, and carrying out lamination; S4, taking out the glue blocking piece, and sequentially carrying out copper plating and tin plating; S5, enabling the tin located at the bottom of the blind groove to be subjected to laser ablation, the laser ablation speed ranging from 400 mm / s to 700 mm / s; S6, corroding the copper located at the bottom of the blind groove; and S7, removing tin on the surface of the circuit board and in the blind slot. After tin at the bottom of the blind groove is subjected to laser ablation, copper at the bottom of the blind groove is corroded to obtain a required design pattern, so that the problem of circuit connection caused by the fact that metal at the bottom of the blind groove covers a circuit layer of a circuit board is solved.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, and in particular relates to a processing method for blind grooves of circuit boards. Background technique [0002] Circuit board, also known as PCB, printed circuit board, which uses insulating board as the base material, cuts to a certain size, has at least one conductive pattern on it, and is equipped with holes (such as component holes, fastening holes, metallized holes, etc.) ), used to replace the chassis of the previous installation of electronic components and realize the interconnection between electronic components. [0003] Blind slots are one of the conventional design types of printed circuit boards. They are mainly used to install components or fix products, improve the overall integration of products or achieve the function of signal shielding. However, when the circuit board needs to be copper-plated and tin-plated during the production process, the bottom of the blind slo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
CPCH05K3/403
Inventor 周德良郑伟生徐梦云李超谋
Owner 珠海杰赛科技有限公司
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