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Examination device

A technology for inspection devices and inspection rooms, applied in the direction of measuring devices, material analysis through optical means, instruments, etc., to achieve the effect of suppressing pollution

Pending Publication Date: 2021-05-28
HITACHI HIGH-TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in such a surface inspection device, foreign matter is not completely free from movable parts, etc., and there is a concern that foreign matter may adhere to the substrate to be inspected (substrate to be inspected) as in other processes.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0049] figure 1 It is a schematic plan view showing components of the inspection device 10 according to Embodiment 1 of the present invention. When the cassette 200 carrying the semiconductor wafer 20 as a substrate is installed in the inspection apparatus 10 , the semiconductor wafer 20 is introduced into the inspection apparatus 10 by the processing mechanism 300 , and the semiconductor wafer 20 is aligned by the pre-aligner 310 . Thereafter, the semiconductor wafer 20 is transported to the inspection room 100 . The inspection chamber 100 receives the semiconductor wafer 20 at a receiving position (Transfer Position: TP), moves to an inspection position (Measurement Position: MP), and starts inspection of the semiconductor wafer 20 . Thereafter, the entire surface of the semiconductor wafer 20 is inspected by moving while rotating from the MP position toward the TP position. The gas supply device 110 supplies a clean gas flow into the inspection chamber 100 .

[0050] f...

Embodiment approach 2

[0097] Figure 7A It is a figure which shows the structural example of the rectifying plate 140 in Embodiment 2 of this invention. The structure other than the rectifying plate 140 is the same as that of Embodiment 1, so the following description will mainly be made on the points of difference related to the rectifying plate 140 . In the second embodiment, the angle formed by the first portion 141 and the second portion 142 is an obtuse angle and larger than that in the first embodiment. In Embodiment 2, similarly to Embodiment 1, the function of guiding the air flow below table 120 is produced, but it differs from Embodiment 1 in the following points.

[0098] In order to keep the periphery of the semiconductor wafer 20 clean, it is preferable to reliably guide the clean air flow from above the semiconductor wafer 20 toward below the stage 120 . As shown in FIG. 6 , in Embodiment 2, the distance between the first portion 141 and the upper surface of the table 120 is configu...

Embodiment approach 3

[0101] Figure 7B It is a figure which shows the structural example of the rectifying plate 140 in Embodiment 3 of this invention. The structure other than the rectifying plate 140 is the same as that of Embodiment 1, so the following description will mainly be made on the points of difference related to the rectifying plate 140 . In Embodiment 3, the rectifying plate 140 is curved in an arched shape. A portion of the arch that substantially overlaps the upper surface of the table 120 when projected onto a horizontal plane corresponds to the first portion 141 , and the remaining portion corresponds to the second portion 142 .

[0102] Also in the third embodiment, as in the first embodiment, the function of guiding the clean gas flow supplied by the gas supply device 110 from above the semiconductor wafer 20 to below the stage 120 is produced. Furthermore, similarly to Embodiment 2, the distance between the first portion 141 and the upper surface of the table 120 gradually d...

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PUM

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Abstract

The purpose of the present invention is to allow a clean airflow around a substrate to reliably move downward of the substrate in an examination device in which clean air is supplied to an inspection chamber. This examination device is provided with a rectifying plate (see FIG. 4A) which covers a part of the upper surface of a stage for mounting a substrate, and is disposed between a gas supply unit and the stage to block an airflow toward the substrate.

Description

technical field [0001] The invention relates to an inspection device for inspecting a substrate. Background technique [0002] In the semiconductor manufacturing process, if foreign matter exists on the substrate (semiconductor wafer), it will cause defects such as poor insulation of wiring and short circuits. These foreign substances are mixed in various states such as generated from movable parts such as conveying equipment, generated from the human body, generated by the reaction of process gas in the processing equipment, and mixed with chemicals and materials. Also in the manufacturing process of a magnetic disk or a liquid crystal display element, the adhesion of generated foreign matter to the substrate (magnetic disk or liquid crystal display element) becomes a cause of failure. [0003] Therefore, in the manufacturing process, use a surface inspection device to detect and manage foreign matter on the surface of the substrate, thereby monitoring and controlling the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66G01N21/956
CPCG01N2021/151G01N21/9501G01N21/15
Inventor 佐藤良广增田俊夫松野均芝山慧吉村修饭岛雄一郎
Owner HITACHI HIGH-TECH CORP