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Semiconductor laser device and optical pickup device

A laser device and semiconductor technology, which is applied to semiconductor lasers, structural details of semiconductor lasers, beam guiding devices, etc., can solve the problems of low diffraction efficiency, difficulty in use, low signal intensity of diffracted beams, etc., to achieve high power and reduce Effects of optical loss and high sensitivity

Inactive Publication Date: 2004-12-01
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] As a result, the ratio of the 0th-order diffracted beam in the hologram element 104 must be set to a higher value, but, in this case, the diffraction efficiency in the hologram element 104 on the backward path will inevitably become low, thereby The signal strength of the diffracted light beam diffracted toward the light receiver 102 will inevitably become lower
Also, since the hologram element 104 has a high ratio of the 0th order diffracted beam, the ratio of the backward beam from the disc to the laser chip 101 will also be high, causing noise as described above, which can cause difficulties in use

Method used

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  • Semiconductor laser device and optical pickup device
  • Semiconductor laser device and optical pickup device
  • Semiconductor laser device and optical pickup device

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Embodiment Construction

[0050] Embodiments of the present invention will be described below with reference to the drawings.

[0051] figure 1 The configuration of a semiconductor laser device according to an embodiment of the present invention is shown.

[0052] This semiconductor laser device 1 has a semiconductor laser chip 2 as a laser emitting part, and a first light receiving part 3A and a second light receiving part 3A placed on both sides of the semiconductor laser chip 2 so as to be separated from the semiconductor laser chip 2 by a predetermined distance in the X-axis direction. The light receiving part 3B. These first light receiving member 3A and second light receiving member 3B constitute a laser receiving member.

[0053] The semiconductor laser chip 2 is mounted on the mounting portion 4A of the rod 4 , and the first light receiving member 3A and the second light receiving member 3B are mounted on the upper surface 4A- 1 of the mounting portion 4A of the rod 4 .

[0054] Further, th...

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Abstract

Semiconductor laser device and optical pickup device. In this semiconductor laser device, a polarization hologram transmits an outgoing beam directed from a semiconductor laser chip to an optical disk as a forward beam without diffracting the beam, and diffracts a backward beam of the laser beam, which is a return beam of the forward beam that has been reflected by the optical disk, so that the backward beam is deflected from a direction directed toward the semiconductor laser chip part and further directed toward first, second photoreception parts. Therefore, optical loss on the forward way from the semiconductor laser chip to the optical disk can be reduced, and return light to the semiconductor laser chip can be suppressed, so that a high-power, high-sensitivity semiconductor laser device can be realized.

Description

(1) Technical field [0001] The present invention relates to a semiconductor laser device and an optical pickup device, for example, to a semiconductor laser device and an optical pickup device suitable for an optical disc device that optically records information on or from an information recording medium such as an optical disc. reproduce the information. (2) Background technology [0002] In order to make the optical pickup device smaller in size, thinner in thickness and higher in reliability, an optical pickup device equipped with a hologram element has appeared. FIG. 8 shows an example of a semiconductor laser device equipped with a hologram element to constitute an optical pickup device. [0003] In this semiconductor laser device, first, a laser beam 107 emitted from a semiconductor laser chip 101 is diffracted by a grating element 103 . Note that the semiconductor laser chip 101 is placed on the rod 106 and the grating element 103 is placed on the hologram element / ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11B7/125G02B27/10G02B27/28G11B7/12G11B7/123G11B7/13G11B7/131G11B7/135G11B7/1353G11B7/1381H01S3/08H01S5/00H01S5/02H01S5/022H01S5/068
CPCG11B7/1353G11B7/1381G02B27/1086G11B7/1205H01S5/02212G11B7/131G02B27/145H01S5/02248H01S5/02296G02B27/283G02B27/106G11B7/123H01S5/02257H01S5/02325
Inventor 池原正博增井克荣土田和弘酒井启至
Owner SHARP KK