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Display device and manufacturing method thereof

A technology for display devices and light-emitting elements, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as high complexity and long process time, and achieve the effect of shortening process time and reducing process defect rate

Pending Publication Date: 2021-06-04
SAMSUNG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these conventional methods require precise alignment between the pixel region and the LEDs during the transfer process, and require a process for bonding the LEDs individually, making the complexity high and the process time long

Method used

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  • Display device and manufacturing method thereof
  • Display device and manufacturing method thereof
  • Display device and manufacturing method thereof

Examples

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Embodiment Construction

[0036] Since the disclosure allows various changes and many embodiments, specific embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present disclosure to a specific mode of practice, and it will be understood that all changes, equivalents and substitutions that do not depart from the spirit and technical scope of the present disclosure are included in the present disclosure.

[0037] Throughout the disclosure, like reference numerals refer to like parts throughout the various figures and embodiments of the present disclosure. The size of elements in the drawings may be exaggerated for clarity of illustration. It will be understood that, although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element discussed ...

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Abstract

The present invention relates to a display device manufacturing method and a display device according to same, the method comprising the steps of: placing a plurality of light-emitting elements on a first transfer film; elongating the first transfer film such that the plurality of light-emitting elements are spaced apart from each other; transferring the plurality of light-emitting elements onto a TFT array substrate; and removing the transfer film from the plurality of light-emitting elements.

Description

technical field [0001] Various embodiments of the present disclosure relate to a display device and a method of manufacturing the same. Background technique [0002] A display device displays an image using a combination of light emitted from a plurality of pixels. In a display device, each pixel includes a pixel circuit and a display element controlled in operation by the pixel circuit. A light emitting diode, which is a self-emitting element among display elements, includes a pixel electrode, an emission layer, and a common electrode. [0003] One of the pixel electrode and the common electrode is an anode for hole injection, and the other is a cathode for electron injection. Holes injected from the anode and electrons injected from the cathode combine in the emission layer to generate excitons, and the excitons release energy to emit light. [0004] The light emitting diodes may be formed on the backplane by a Pick and Place method or a roll transfer method. However, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L27/15H01L23/528H01L33/36
CPCH01L23/528H01L33/36H01L27/15H01L27/12H01L25/0753H01L2933/0033H01L25/167H01L21/6835H01L2221/68368H01L27/1214H01L27/156H01L24/95H01L2221/68381H01L2224/95001
Inventor 崔镇宇金敏佑宋大镐全亨一
Owner SAMSUNG DISPLAY CO LTD
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