Display device and manufacturing method thereof

A technology for display devices and light-emitting elements, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as high complexity and long process time, and achieve the effect of shortening process time and reducing process defect rate
CN112913019APending Publication Date: 2021-06-04SAMSUNG DISPLAY CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SAMSUNG DISPLAY CO LTD
Publication Date
2021-06-04

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Abstract

The present invention relates to a display device manufacturing method and a display device according to same, the method comprising the steps of: placing a plurality of light-emitting elements on a first transfer film; elongating the first transfer film such that the plurality of light-emitting elements are spaced apart from each other; transferring the plurality of light-emitting elements onto a TFT array substrate; and removing the transfer film from the plurality of light-emitting elements.
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Description

technical field

[0001] Various embodiments of the present disclosure relate to a display device and a method of manufacturing the same. Background technique

[0002] A display device displays an image using a combination of light emitted from a plurality of pixels. In a display device, each pixel includes a pixel circuit and a display element controlled in operation by the pixel circuit. A light emitting diode, which is a self-emitting element among display elements, includes a pixel electrode, an emission layer, and a common electrode.

[0003] One of the pixel electrode and the common electrode is an anode for hole injection, and the other is a cathode for electron injection. Holes injected from the anode and electrons injected from the cathode combine in the emission layer to generate excitons, and the excitons release energy to emit light.

[0004] The light emitting diodes may be formed on the backplane by a Pick and Place method or a roll transfer method. However, ...

Claims

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