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Punch device for automatic punching sampling of copper plate and punching method of punch device

A technology of punching and punching, which is applied in the field of punching devices for automatic punching and sampling of copper plates, and can solve problems such as cost reduction, incomplete punching, and inability to obtain small samples

Inactive Publication Date: 2021-06-08
科大智能物联技术股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The disadvantage of the existing technology is that the traditional stamping method is drilling, which will cause burrs on the sample and incomplete stamping
At the same time, it is impossible to obtain small samples with a diameter of less than 40mm, reducing costs and other issues

Method used

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  • Punch device for automatic punching sampling of copper plate and punching method of punch device
  • Punch device for automatic punching sampling of copper plate and punching method of punch device
  • Punch device for automatic punching sampling of copper plate and punching method of punch device

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] Please refer to figure 1 , in an embodiment of the present invention, a punch device for automatic punching and sampling of copper plates, including:

[0030] Upper punch 1;

[0031] The lower punch 21 assembly 2, which includes the lower punch 21 arranged at the coaxial lower end of the upper punch 1, the telescopic assembly 22 arranged on the outer side of the lower punch 21 in the circumferential direction, and the telescopic assembly 22 arranged ou...

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PUM

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Abstract

The invention discloses a punch device for automatic punching sampling of a copper plate and a punching method of the punch device. The punch device comprises an upper punch and a lower punch assembly, wherein the upper punch is of an embedded punching-down structure and is provided with a locating sleeve, and the locating sleeve is made of a reinforced nylon material; the lower punch assembly comprises a lower punch arranged at the coaxial lower end of the upper punch, a telescopic assembly arranged on the outer side of the lower punch in the circumferential direction and an elastic piece arranged on the outer side of the telescopic assembly and used for buffering springback; and the telescopic assembly comprises a first copper bush arranged on the outer side of the lower punch in the circumferential direction and a second copper bush arranged at the bottom of the first copper bush. The punching method comprises the steps that the copper plate to be punched is moved to a punching sampling point; impact cut-off is conducted; the relative position of the lower punch rises to jack up a copper block sample; and the copper plate is bounced off under the reverse thrust action of a right-handed spring, and sampling is conducted by multiple times through cyclic operation. According to the punch device, the copper plate is cut off through the upper punch and the lower punch in cooperation with the elastic piece, so that complete cut-off is ensured, and the wire drawing problem is avoided.

Description

technical field [0001] The invention relates to the technical field of punch punching and sampling, in particular to a punch device and a punching method for automatic punching and sampling of copper plates. Background technique [0002] Punching sampling is required before the cathode electrolytic copper is put into the warehouse. The more mature punching sampling technology can increase the sampling efficiency during the process of conveying into the warehouse, connect the original conveying line, and realize the entire workflow of automatic punching and automatic sampling. [0003] The disadvantage of the prior art is that the traditional punching method is a drilling method, which will cause burrs on the sample and incomplete punching. At the same time, it is impossible to obtain small samples with a diameter of less than 40mm, which reduces costs and the like. Contents of the invention [0004] The purpose of the present invention is to overcome the deficiencies in t...

Claims

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Application Information

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IPC IPC(8): B21D28/26B21D43/00B21D45/00
CPCB21D28/26B21D43/003B21D45/00
Inventor 谷伟志程诗斌马李军钟智敏
Owner 科大智能物联技术股份有限公司
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