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Strip cutting device and strip cutting method

A die-cutting and cutting technology, applied in the direction of work accessories, manufacturing tools, stone processing tools, etc., can solve the problems of scattered processes, reduced production capacity, waste of manpower and material resources, etc.

Active Publication Date: 2022-07-05
LANS INTELLIGENT ROBOT CHANGSHA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a strip material cutting device and a strip material cutting method, so as to alleviate the slicing process of the slicing process for processing the back cover panel in the prior art, which wastes a lot of manpower and material resources, resulting in a high production capacity. Reduced technical issues

Method used

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  • Strip cutting device and strip cutting method
  • Strip cutting device and strip cutting method
  • Strip cutting device and strip cutting method

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Embodiment Construction

[0056] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

[0057] Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary ski...

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Abstract

The invention provides a strip cutting device and strip cutting method, and relates to the technical field of strip processing equipment. The strip cutting device includes an upper die assembly and a lower die assembly; the upper die assembly includes a support , drive assembly and die-cutting assembly, the drive assembly is connected with the die-cutting assembly in a transmission; the die-cutting assembly includes a first floating pressure block, a second floating pressure block and a fillet slitting and kicking die; the lower die assembly includes a lower die base, A fixed lower die and a floating lower die; between the fixed lower die and the floating lower die, a concave cavity for making the fillet die-cutting part die-cut with fillet material. The back cover panel is made by slitting with a material slitting device. The electronic product includes a rear cover panel. The tape slitting method utilizes a tape slitting device for slitting. The tape slitting device solves the technical problems in the prior art that the slicing process for processing the back cover panel is relatively scattered, wastes a lot of manpower and material resources, and leads to reduced production capacity.

Description

technical field [0001] The invention relates to the technical field of strip processing equipment, in particular to a strip cutting device and a strip cutting method. Background technique [0002] As electronic products have higher and higher requirements for signal transmission, ceramic materials have gradually become a popular An important choice for electronic products to achieve differentiation. [0003] At present, some electronic products mostly use ceramic material as the back cover panel, and in the process of ceramic material processing, the ceramic material needs to be melt-blown into a soft strip, and then cut into the shape of the back cover of the mobile phone, and then hardened to The ceramic slice shape is finished. In this process, the ceramic strip needs to be continuously and precisely cut, so that the semi-finished waste residue left in the subsequent hardening and finishing process is minimal, which not only saves processing time, but also maximizes the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D1/22B28D7/00B28D7/04
CPCB28D1/22B28D7/00B28D7/04Y02P70/10
Inventor 冯金果
Owner LANS INTELLIGENT ROBOT CHANGSHA CO LTD
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