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A cutting method for brittle and hard materials with diamond wire

A cutting method and technology of diamond wire, applied in the field of brittle and hard material cutting, can solve the problems of broken diamond wire, low cutting efficiency, high roughness of cutting surface, and achieve the effect of not easy to break, high cutting efficiency, and reducing the risk of breakage

Active Publication Date: 2022-04-01
福州天瑞线锯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cutting efficiency of the existing diamond wire cutting process is low, especially if the long diamond wire is cut repeatedly, the roughness of the cutting surface will be high; and if the unidirectional cutting method is used, the diamond wire is prone to breakage

Method used

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  • A cutting method for brittle and hard materials with diamond wire
  • A cutting method for brittle and hard materials with diamond wire
  • A cutting method for brittle and hard materials with diamond wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The maximum longitudinal length of the brittle and hard material is L, and the maximum transverse width is M; while the cutting is driven by the lifting mechanism to move the diamond wire to the brittle and hard material, the diamond wire forms a line between the two horizontal rotating wheels of the lifting mechanism. Arc, the line arc performs cutting line movement to realize the cutting of brittle and hard materials; the distance between the axes of the two rotating wheels is T1.2M≤T≤10M; the cutting process includes S1, S2, S3, S4, 4 steps ; In step S1, the diamond wire is fed downwards for cutting, and the distance of the longitudinal moving position of the rotating wheel is 5%-30% L; in step S2, the diamond wire is fed downwards for cutting, and the distance of the longitudinal moving position of the rotating wheel is 101 %-150%L; Step S3, the diamond wire is retracted upwards, and the distance to the longitudinal movement position of the rotating wheel is 100%-130...

Embodiment 2

[0034] Using a diamond wire cutting machine (while the diamond wire is driven by the lifting mechanism to move to the brittle and hard material, the diamond wire forms a wire arc between the two horizontal rotating wheels of the lifting mechanism, and the wire arc performs cutting wire movement to realize the cutting of the brittle and hard material. Cutting, the brittle and hard material is that the longitudinal section is circular (diameter 400mm), the diameter of the turning wheel is 150-500mm, and the distance between the turning wheels is 900mm. The cutting process includes the following cutting machine control steps:

[0035] Carry out longitudinal cutting to brittle and hard material with diamond wire cutting machine, comprise following cutting machine control steps: S1: Diamond wire feeds and cuts downwards, cutting line speed 100m / s, feed speed 300mm / min, described rotating wheel longitudinally moves The position distance from S1 is 20%L;

[0036] S2: The diamond wire...

Embodiment 3

[0041]Using a diamond wire cutting machine (while the diamond wire is driven by the lifting mechanism to move to the brittle and hard material, the diamond wire forms a wire arc between the two horizontal rotating wheels of the lifting mechanism, and the wire arc performs cutting wire movement to realize the cutting of the brittle and hard material. Cutting, the brittle and hard material is that the longitudinal section is circular (diameter 400mm), the diameter of the turning wheel is 300-500mm, and the distance between the turning wheels is 1200mm. The cutting process includes the following cutting machine control steps:

[0042] The brittle and hard material is longitudinally cut with a diamond wire cutting machine, including the following cutting machine control steps: S1: the diamond wire is fed downwards and cut, the cutting line speed is 60m / s, the feed speed is 500mm / min, and the rotating wheel moves longitudinally The position distance S1 is 30%L;

[0043] S2: The dia...

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Abstract

The invention provides a method for cutting brittle and hard materials by using diamond wire. The cutting process includes four steps: S1, S2, S3, and S4. In step S1, the diamond wire is fed downward for cutting, and the rotating wheel The longitudinal moving position distance is 5%-30%L; in step S2, the diamond wire is fed downward for cutting, and the longitudinal moving position distance of the rotating wheel is 101%-150%L; in step S3, the diamond wire is retracted upwards, The distance to the longitudinal moving position of the rotating wheel is 100%-130%L; in step S4, the diamond wire is fed downward and cut until the brittle and hard material is cut through. In the cutting process, due to the addition of the S3 step back, the cutting efficiency of the diamond wire is high, it is not easy to break, and the surface roughness can reach Ra0.8‑3.2.

Description

technical field [0001] The invention relates to the field of cutting brittle and hard materials, in particular to a diamond wire cutting method for brittle and hard materials. Background technique [0002] Diamond wire cutting of single and polycrystalline silicon rods has become the mainstream of solar-grade silicon wafer cutting, and various special machine tools and modified machine tools have been put into use. Electroplated diamond wire has become the main consumable for silicon wafer cutting, and the price of electroplated diamond wire is nearly a hundred times that of ordinary steel wire. In order to reduce the cost of consumables, various silicon wafer processing enterprises have adopted various measures to save the amount of diamond wire used. [0003] Therefore, cutting brittle and hard materials such as silicon rods and precious stones with diamond wires is currently a conventional method in this field. However, the cutting efficiency of the existing diamond wire...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D7/00
CPCB28D5/045B28D5/0064B28D5/0058
Inventor 林冬林桂峰刘林炎苏宇华李海威李波林光展
Owner 福州天瑞线锯科技有限公司