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Method and system for massive transfer of micro-light-emitting diode chips

A technology of micro-light-emitting diodes and transfer methods, applied in semiconductor devices, electrical components, circuits, etc.

Active Publication Date: 2022-04-29
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the deficiencies in the prior art above, the purpose of this application is to provide a method and system for mass transfer of micro-LED chips, aiming to solve the problem of how to provide a mass transfer method with simple process and unlimited transfer quantity at one time

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  • Method and system for massive transfer of micro-light-emitting diode chips
  • Method and system for massive transfer of micro-light-emitting diode chips
  • Method and system for massive transfer of micro-light-emitting diode chips

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Embodiment Construction

[0036] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application.

[0038] At present, the mainstream in the industry is to transfer a large number o...

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Abstract

A method and system for mass transfer of micro-light-emitting diode chips, the method comprising: forming a plurality of micro-light-emitting diodes on an extension layer, attaching the surface of the extension layer facing away from the micro-light-emitting diode chips to a second substrate; A plurality of slits are formed on the substrate, and each slit corresponds to the interval between two adjacent micro light emitting diode chips; the extension layer is squeezed so that the extension layer is deformed and extended into the slit; the extension layer is stretched; the multiple Micro LED chips are transferred to the backplane. By forming a gap on the second substrate, expanding the crystal by squeezing and stretching the extension layer, the process is simple. Since the size of the second substrate and the extension layer is not limited, a large number of micro-light-emitting diode chips can be transferred at one time, and the number of transfers is not large. restricted.

Description

technical field [0001] The invention relates to the technical field of mass transfer of micro light emitting diodes, in particular to a method and system for mass transfer of micro light emitting diode chips. Background technique [0002] The current bottleneck in the Micro-LED (micro-light-emitting diode) display technology industry mainly lies in chip production, mass transfer, and full-color display. In terms of mass transfer technology, the current mainstream in the industry is to use electrostatic / magnetic force / vacuum adsorption, Van der Waals printing, adhesive force, fluid assembly and other technologies to transfer a large number of chips. Among them, van der Waals force is widely used. Van der Waals force printing technology uses PDMS (polydimethylsiloxane) material as the medium to make bumps, and the micro-viscosity generated by PDMS is used for selective transfer. The requirements for flatness are extremely high, and the size of the transfer head is limited by ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/683H01L25/075H01L27/15H01L33/48H01L33/62
CPCH01L21/67144H01L21/6835H01L33/48H01L33/62H01L25/0753H01L27/156H01L2221/68368H01L2221/68381H01L2933/0033H01L2933/0066
Inventor 李欣曈洪温振
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD