Water-based formaldehyde-free adhesive for flame-retardant composite board and preparation method thereof

An aldehyde adhesive, water-based technology, applied in the field of water-based formaldehyde-free adhesive for flame-retardant composite panels and its preparation, can solve problems such as physical damage, unimaginable consequences, and rapid spread, and achieve enhanced tensile strength and durability Grinding performance, effect of reducing concentration

Active Publication Date: 2021-06-22
上海德万家企业发展(集团)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, plywood is widely used in daily life. There are plywood everywhere in floor boards, ceilings, furniture, and decoration materials. The use of plywood is inseparable from adhesives, and most of the adhesives on the market are phenolic adhesives. Over time, formaldehyde will be released slowly, causing considerable damage to the human body. At the same time, there are many problems with water-ba

Method used

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  • Water-based formaldehyde-free adhesive for flame-retardant composite board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A method for preparing a water-based formaldehyde-free adhesive for a flame-retardant composite board, comprising the following steps:

[0043] S1: reacting aluminum nitrate nonahydrate with sodium fumarate to prepare a fumaric acid-aluminum complex;

[0044] S2: Preparation of network polyurethane, coated with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide to obtain 9,10-dihydro-9-oxa-10-phospha Phenanthrene-10-oxide complex;

[0045] S3: reacting soybean polysaccharide with isocyanate to prepare microencapsulated isocyanate;

[0046] S4: Mix fumaric acid-aluminum complex, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide complex, microencapsulated isocyanate and defatted soy flour to prepare adhesive agent.

[0047] Among them, S1:

[0048] Mix aluminum nitrate nonahydrate with deionized water, heat in a water bath to 30°C, stir for 10 minutes, add sodium fumarate, heat in a water bath to 45°C, stir for 20 minutes, ultrasonically oscillate for 20 minutes, fil...

Embodiment 2

[0056] A method for preparing a water-based formaldehyde-free adhesive for a flame-retardant composite board, comprising the following steps:

[0057] S1: reacting aluminum nitrate nonahydrate with sodium fumarate to prepare a fumaric acid-aluminum complex;

[0058] S2: Preparation of network polyurethane, coated with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide to obtain 9,10-dihydro-9-oxa-10-phospha Phenanthrene-10-oxide complex;

[0059] S3: reacting soybean polysaccharide with isocyanate to prepare microencapsulated isocyanate;

[0060] S4: Mix fumaric acid-aluminum complex, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide complex, microencapsulated isocyanate and defatted soy flour to prepare adhesive agent.

[0061] Among them, S1:

[0062] Mix aluminum nitrate nonahydrate with deionized water, heat in a water bath to 30°C, stir for 15 minutes, add sodium fumarate, heat in a water bath to 45°C, stir for 25 minutes, ultrasonically oscillate for 25 minutes, fil...

Embodiment 3

[0070] A method for preparing a water-based formaldehyde-free adhesive for a flame-retardant composite board, comprising the following steps:

[0071] S1: reacting aluminum nitrate nonahydrate with sodium fumarate to prepare a fumaric acid-aluminum complex;

[0072] S2: Preparation of network polyurethane, coated with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide to obtain 9,10-dihydro-9-oxa-10-phospha Phenanthrene-10-oxide complex;

[0073] S3: reacting soybean polysaccharide with isocyanate to prepare microencapsulated isocyanate;

[0074] S4: Mix fumaric acid-aluminum complex, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide complex, microencapsulated isocyanate and defatted soy flour to prepare adhesive agent.

[0075] Among them, S1:

[0076] Mix aluminum nitrate nonahydrate with deionized water, heat in a water bath to 30°C, stir for 20 minutes, add sodium fumarate, heat in a water bath to 45°C, stir for 30 minutes, ultrasonically oscillate for 30 minutes, fil...

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Abstract

The invention discloses a water-based formaldehyde-free adhesive for a flame-retardant composite board and a preparation method thereof. The adhesive is mainly prepared from a fumaric acid-aluminum complex, a 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide compound, a microencapsulated isocyanate and defatted bean flour. During high-temperature combustion, isocyanate generated by decomposition of defatted bean flour and isocyanate generated by decomposition of polyurethane react with fumaric acid to form an imine structure, the 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and the imine structure are subjected to an addition reaction to generate a nitrogen-containing compound, the nitrogen-containing compound is thermally decomposed during combustion to generate ammonia inert gas, the combustible gas concentration and the combustion rate are reduced; the nitrogen-containing compound is subjected to a nitrogen-containing reaction to form a nitrogen-containing flame retardant, and the concentration and combustion rate of combustible gas are reduced. The nitrogen-containing compound is combusted to form a carbon layer, molten drops are reduced, and the flame retardant property is improved. The adhesive prepared by the method improves the water resistance on the basis of a water-based adhesive, does not contain aldehyde groups, does not release formaldehyde to pollute the environment, has good flame retardant property, can effectively slow down the combustion rate of the composite board, and has very high practicability and production value.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a water-based formaldehyde-free adhesive for flame-retardant composite boards and a preparation method thereof. Background technique [0002] At present, plywood is widely used in daily life. There are plywood everywhere in floor boards, ceilings, furniture, and decoration materials. The use of plywood is inseparable from adhesives, and most of the adhesives on the market are phenolic adhesives. Over time, formaldehyde will be released slowly, causing considerable damage to the human body. At the same time, there are many problems with water-based adhesives on the market, among which water resistance is the biggest problem. [0003] At the same time, plywood is a flammable material. Once it catches fire, the fire will spread rapidly and the consequences will be disastrous. Therefore, in order to solve the above problems, the present invention proposes a water-based formaldehyde...

Claims

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Application Information

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IPC IPC(8): C09J189/00C09J11/06
CPCC09J189/00C09J11/06C08K5/0091C08K9/10C08K5/29C08K5/5313
Inventor 王德胜
Owner 上海德万家企业发展(集团)有限公司
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