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A kind of black polyimide film containing high compatibility pigment and preparation method thereof

A technology of polyimide film and polyimide matrix, which is applied in the field of black polyimide masking film, black polyimide film and its preparation, can solve the problem of reducing the insulation and mechanical properties of polyimide film, Increase production costs, affect performance and other issues, to achieve the effect of wide applicability and application promotion value

Active Publication Date: 2022-05-10
SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the addition of a large amount of carbon black will greatly reduce the insulation and mechanical properties of the polyimide film, especially the reduction of its insulation performance.
However, commercial carbon black is generally difficult to disperse, and the amount of dispersant added is too large (usually greater than 50%, relative to the mass of carbon black)
The addition of excessive dispersant will bring a series of adverse effects on the production process, affecting its performance and increasing production costs

Method used

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  • A kind of black polyimide film containing high compatibility pigment and preparation method thereof
  • A kind of black polyimide film containing high compatibility pigment and preparation method thereof
  • A kind of black polyimide film containing high compatibility pigment and preparation method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0037] Preparation of polyamic acid resin solution. Polyamic acid resin can be prepared by copolymerization of dianhydride and diamine. Wherein, the diamine can be phenylenediamine, diaminodiphenyl ether or derivatives thereof, and the like. Specific examples of diamines include: p-phenylenediamine, o-phenylenediamine, m-phenylenediamine, 3,4-diaminodiphenyl ether, 2,4-diaminodiphenyl ether, 4,4'- Diaminodiphenyl ether (ODA), etc. Examples of dianhydrides include: biphenylcarboxylic dianhydride or derivatives thereof, and pyromellitic dianhydride or derivatives thereof. Specific examples of dianhydrides may include 3,3',4,4'-biphenyltetracarboxylic dianhydride, pyromellitic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride , p-phenylene-bistrimellitic dianhydride, etc., preferably 3,3',4,4'-biphenyltetracarboxylic dianhydride and pyromellitic diketone. In particular, 3,3',4,4'-biphenyltetracarboxylic dianhydride or pyromellitic dianhydride.

[0038] The disp...

Embodiment 1

[0045] Embodiment 1: the preparation of polyimide film

[0046] Experimental raw materials: N,N-dimethylacetamide (DMAc), pyromellitic dianhydride (PMDA), 4,4’-diaminodiphenyl ether (ODA);

[0047] Experimental equipment: double-layer glass reactor, circulating cooler, electric stirrer;

[0048] When preparing polyamic acid, the solid content of the control system was about 20%, and the temperature of the circulating cooler was set at 25°C during the experiment. Add 40g DMAc to the double-layer glass reactor, add 4.786g ODA, start the electric stirrer and stir until the ODA is completely dissolved. Divide 98% PMDA in an equimolar amount (5.214g) with ODA into two parts, slowly add the first part of dianhydride into the reactor, and stir for 10-15 minutes until the reaction is completely exothermic. Then slowly add the second part of dianhydride into the reactor, and stir for 30 minutes until the reaction is completely no longer exothermic. The remaining 2% ODA molar amount ...

Embodiment 2

[0051] Embodiment 2: the preparation of black polyimide film

[0052] Carbonization of polyimide: take 10 g of the polyimide film prepared in Example 1, put it into a crucible, and raise the temperature from room temperature to 900° C. within 2 hours under the protection of circulating nitrogen gas, and keep it warm for 4 hours to obtain a black product;

[0053] Preparation of black slurry: 2g of the product obtained in the above steps, 0.1g of dispersant Merck MOK-5032 (5% of the solid mass), 18g of N,N-dimethylacetamide (DMAc), 20g of yttrium stabilizer with a diameter of 0.3mm Add zirconia grinding balls into a 100ml high-energy ball mill jar, and grind for 2 hours to obtain a black slurry. Detected by a laser particle size analyzer, the particle size is 18nm (D90);

[0054] Preparation of black polyimide film: it is basically the same as the method for preparing polyimide film in Example 1, except that 35g of the 40g DMAc used in the system is used for the dissolving of ...

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Abstract

The invention relates to a black polyimide film containing high compatibility pigment and a preparation method thereof. The black polyimide film containing high compatibility pigment comprises: a polyimide matrix, and a polyimide matrix distributed in the The black coloring material in , the black coloring material at least includes a black pigment converted from carbonizable polymer material by carbonization, and the carbonizable polymer material is a high carbon residue with a high residual carbon rate and a benzene ring group. Molecules; the mass fraction of the black coloring material is 0.1-20%, preferably 0.5-10%, more preferably 1-5%.

Description

technical field [0001] The invention relates to a black polyimide masking film, in particular to a black polyimide film containing highly compatible pigments and a preparation method thereof, which can be used in the field of electronic technology such as flexible printed circuit boards, and belongs to the field of composite functional film preparation. Background technique [0002] Polyimide (PI) film is an important high-temperature-resistant insulating material in electronic products. It is combined with copper foil to play the role of isolation and insulation. It is widely used in electronic devices such as flexible printed circuit boards. With the rapid development of electronic technology, higher and higher requirements are put forward for its performance. Developed transparent yellow PI film, low thermal expansion coefficient PI film, dimensionally stable PI film, low dielectric constant PI film, black PI film, matte black PI film, matte black PI film, etc. Technicia...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K3/013C08J5/18C08G73/10
CPCC08J5/18C08G73/1071C08G73/1007C08J2379/08C08K3/013
Inventor 纪士东李荣金平实
Owner SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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