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Gradient coil cooling component and gradient coil

A technology of gradient coils and cooling components, which is applied to the measurement of magnetic variables, measuring devices, instruments, etc., can solve problems such as the burning of gradient coils, and achieve the effect of ensuring the uniformity of the magnetic field, simple layout, and reducing assembly process time.

Pending Publication Date: 2021-06-29
SIEMENS SHENZHEN MAGNETIC RESONANCE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If effective cooling measures are not taken, the gradient coil may burn out, and the gradient amplifier will also stop working due to overheating of the device

Method used

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  • Gradient coil cooling component and gradient coil
  • Gradient coil cooling component and gradient coil
  • Gradient coil cooling component and gradient coil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] In the embodiment of the present invention, it is considered that the coil main body of the gradient coil generally includes a main coil and a shielding coil, and the main coil and the shielding coil respectively include X, Y, and Z coils. And different gradient coils may have different internal structures. For example, whether it is the main coil or the shielding coil, the layout of the X, Y, and Z coils can have different layout sequences according to the actual situation, such as the layout of the main coil from inside to outside. It can be XYZ, YXZ, ZXY, ZYX, XZY or YZX, and the layout of the shielding coil from inside to outside can be ZXY, ZYX, XYZ, YXZ, XZY or YZX. The flexible coolant pipeline layer (Cooling layer, referred to as the cooling layer, hereinafter denoted by C) for cooling the gradient coil can be arranged inside the gradient coil according to the actual situation, for example, XYCZ, XCYZ, YXCZ, CZXY, CZYX, ZCXY, ZCYX, ZXCY, ZYCX, XYZC, ZCXYC, XYCZC...

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PUM

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Abstract

An embodiment of the invention discloses a gradient coil cooling component and a gradient coil. The gradient coil cooling component comprises a coolant pipeline component and a bearing component, wherein the coolant pipeline component comprises a plurality of high-thermal-conductivity flexible coolant pipelines which are arranged side by side, and the plurality of coolant pipelines which are arranged side by side are fixedly arranged on the bearing component in a manner that coolant inlet pipes and coolant outlet pipes are uniformly arranged in parallel in a snakelike manner and are not crossed with each other; and the plurality of coolant pipelines can be attached to a Z coil of the gradient coil in a manner of being mutually orthogonal to the Z coil. According to the gradient coil cooling component in the embodiment of the invention, the supporting roundness of the cooling layer can be improved, and the magnetic field uniformity of the supporting coil is further ensured.

Description

technical field [0001] The invention relates to the field of gradient coil cooling, in particular to a gradient coil cooling component and a gradient coil. Background technique [0002] In magnetic resonance imaging systems, gradient coils are used to generate frequently switched gradient fields. During the operation of the gradient coils, the current required is as high as several hundred amps, thus generating a large amount of heat in the coils. If effective cooling measures are not taken, the gradient coil may burn out, and the gradient amplifier will also stop working due to overheating of the device. The gradient coils of the X, Y, and Z axes are packaged and fixed in insulating materials, and are tightly arranged in the aperture of the magnet. There is no objective condition for relying on natural heat dissipation from the environment and air-cooled heat dissipation, so the gradient coils need to be cooled in time. [0003] At present, the commonly used method is to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R33/385G01R33/421
CPCG01R33/3856G01R33/4215
Inventor 彭卫平陈小丰
Owner SIEMENS SHENZHEN MAGNETIC RESONANCE