Chip FT and EQC integrated test method and system

Abstract

The invention discloses a chip FT and EQC integrated test method and system, and the method comprises the following steps: an upper computer operates a corresponding test program according to a test request, reads burning code data from the test program based on a test configuration table, and transmits the burning code data to a single-chip microcomputer in an interruption manner; the single-chip microcomputer receives the code burning data, stores the code burning data in the RAM, and burns the code burning data into the chip to be tested; and the host computer performs FT test on the chips to be tested through the single-chip microcomputer, and if the number of the chips to be tested passing the FT test is detected to be greater than or equal to a preset EQC test demand number, the EQC test is performed on the chips to be tested passing the FT test. According to the invention, online burning integration of the to-be-tested chip is realized, the test efficiency is improved, the time cost and the labor cost are saved, only the test program of the upper computer needs to be modified for different burning codes of the same chip, the single-chip microcomputer does not need to be modified again, and the test operation is more convenient.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a chip FT and EQC integrated testing method and system. Background technique [0002] After the chip is packaged, it will be tested by FT (Final Test), also known as Package Test (Package Test), and EQC (Electronic Quality Control) test. The FT test is to test the function of each IC and its specified standards after packaging. EQC is to check the internal coding of the chips that pass the test, and check whether there are any wrong coding products in this batch of chips. When the EQC test fails, the batch of chips will be re-tested. [0003] At present, in the industry's chip testing process that integrates testing and editing, after the FT test is completed, it is often necessary to disassemble the tape and then extract a part for EQC testing. This method of testing is very inconvenient, wastes time, and has low test efficiency. It also increases manpower. and material c...

AI Technical Summary

Problems solved by technology

[0003] At present, in the industry's chip testing process that integrates testing and editing, after the FT test is completed, it is often necessary to disassemble the tape and then extract a part for EQC testing. This method of testing is very inconvenient, wastes time, and has low test efficiency. It also increases manpower. and material cost

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