Rotatable buffering pick-and-place device

Abstract

The invention relates to a rotatable buffering pick-and-place device. The device mainly comprises a motor, a body, a buffering module and a pick-and-place module. The buffering module is arranged in the first cavity of the body, and a rotating bearing of the buffering module is connected to a driving shaft of the motor and is coupled to a driven shaft sleeve through a rotary driving piece; the rotary driving piece is driven by a rotary bearing to drive a driven shaft sleeve to rotate, and allows the rotary bearing and the driven shaft sleeve to axially move; a buffer spring is arranged between the rotating bearing and the driven shaft sleeve; a first sealing ring and a second sealing ring of the pick-and-place module are fixed on the body and are respectively arranged at two ends of a second cavity; and the pick-and-place shaft rod penetrates through the first sealing ring and the second sealing ring, one end of the pick-and-place shaft rod is connected to the driven shaft sleeve, and an adsorption hole is formed in the other end of the pick-and-place shaft rod and communicated with a negative pressure source.

Description

technical field [0001] The invention relates to a rotatable buffer pick-and-place device, in particular to a pick-and-place device suitable for picking and placing integrated circuits or electronic components in semiconductor packaging and testing processes. Background technique [0002] In the semiconductor packaging or testing process, it is common to transfer the DUT, for example, transfer the DUT from the tray to the test socket for testing. At present, the more commonly used pick-and-place method is the method of adsorption, that is, the object to be tested is sucked by negative pressure and then transferred, and the negative pressure is canceled after reaching the destination, and the object to be tested can be placed. [0003] However, since the object to be tested is a wafer or a micro-integrated circuit, which is quite fragile, it is easily damaged when the pick-and-place force is too strong, so the pick-and-place device must usually be equipped with a buffer mechan...

AI Technical Summary

Problems solved by technology

[0005] However, the cushioning effect of this magnetic attraction mechanism is not good, and it often happens that it cannot be completely reset; moreover, multiple sets of devices are often used together on the test machine, and it often happens that each set of devices absorbs or places the object under test. The high and low positions of the pick-and-place end are different, which is easy to cause errors in subsequent use

In addition, the rotation mechanism using magnetic attraction is also flawed. When the rotation is affected by foreign objects or external forces, it is likely to cause the situation that the drive shaft and the driven shaft cannot be linked.

[0006] In addition, the device disclosed in the patent technology, in many cases of use, its adsorption effect will produce unintended cancellation

For example, as mentioned in the previous paragraph, because it often cannot be fully reset, once the user wants to manually pull down the rotating shaft to make it fully reset, the airtight will disappear, that is, the adsorption force will be cancelled, resulting in the adsorption of the UUT dropped

[0007] On the other hand, when the rotating shaft retracts backward (in the direction of the motor position), the adsorption force will also disappear, causing the adsorbed object to be measured to fall

This is because the sealing member used in the technology of this case is not completely fixed, so once the axial displacement of the rotating shaft occurs, the sealing member is likely to be displaced accordingly, resulting in an air gap between the sealing member and the body, resulting in the disappearance of the adsorption force. Situation happens

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