Semiconductor TEC ultralow temperature refrigeration auxiliary circulation system and method

Abstract

The invention discloses a semiconductor TEC ultralow temperature refrigeration auxiliary circulation system and method. The system comprises a heat dissipation base, wherein the interior of the heat dissipation base is of a hollow structure and is provided with a first temperature sensor, a refrigeration circulation loop communicated with the interior of the heat dissipation base is arranged below the heat dissipation base, a circulating pump and a cooling thermal insulation box are mounted on the refrigeration circulating loop, the backflow tail end of the refrigeration circulation loop is connected with a section of parallel branch in series, any branch in the parallel branch is provided with a normally-closed flow magnetic valve, a multistage TEC semiconductor chip is fixed on the top surface of the heat dissipation base, the top surface of the multistage TEC semiconductor chip is a cold end surface, a second temperature sensor is mounted on the cold end surface, and an intelligent temperature control system is electrically connected with the first temperature sensor, the second temperature sensor, the flow magnetic valve and the multistage TEC semiconductor chip. According to the invention, the flow of circulating cooling liquid can be adjusted, the temperature of the hot end of the multistage TEC semiconductor chip is accurately controlled, the temperature fluctuation of the cold end surface is reduced, and the refrigeration efficiency of the multistage TEC semiconductor chip is kept stable.

Description

technical field [0001] The invention relates to the technical field of refrigeration cycle equipment, and more specifically relates to a semiconductor TEC ultra-low temperature refrigeration auxiliary cycle system and method. Background technique [0002] With the wide application of TEC semiconductor chips, especially in its refrigeration, it has significant advantages such as small size, high efficiency, safety and stability, and has been widely used in many fields. However, when the TEC semiconductor chip is cooled by the Peltier effect, the heat generated by the current will be transferred from one side of the TEC to the other side, forming a hot end and a cold end on the TEC. When the cold end is working normally, the heat from the hot end needs to be transferred Discharge in time, otherwise it will affect its cooling efficiency and the lowest temperature value that the cold end can reach. Usually, air cooling and conventional water cooling are used for the hot end of ...

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Problems solved by technology

With the air-cooled method, the fan will be noisy, and the minimum temperature of the cold end can hardly break through -60°C and maintain it for a long time. Using the above two methods, the TEC semiconductor chip basically cannot achieve a lower temperature, -60°C Ultra-low temperatures down to -100°C often require special compressor refrigeration equipment to obtain, which is costly, consumes a lot of energy, and takes a long time

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