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Confluence and heat conduction integrated device of lithium battery protection board MOS switch

An integrated device and protection board technology, which is applied in the direction of circuit heating devices, printed circuits connected with non-printed electrical components, electrical components, etc., can solve the problems of reduced reliability of MOS tubes, small heat dissipation contact surface, and low heat dissipation efficiency , to achieve the effect of improving heat conduction efficiency, improving heat dissipation capacity, and improving conduction efficiency

Pending Publication Date: 2021-07-27
TIANJIN LANGBO MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The MOS tube in the power circuit is the main heat source. The plug-in MOS tube can be fixed on the radiator through the heat-conducting silicone insulating sheet, and the heat is efficiently conducted from the metal sheet on the back of the MOS tube to the radiator; the surface mount MOS tube The metal sheet on the back of the tube is welded on the PCB, and the heat sink can only be bonded to the plastic on the front of the MOS tube. The contact surface is coated with a layer of thermally conductive silicone grease / thermally conductive silicone / thermally conductive silicone insulating sheet, which has a small heat dissipation contact surface and high heat dissipation efficiency. Low, the reliability of the MOS tube is reduced

Method used

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  • Confluence and heat conduction integrated device of lithium battery protection board MOS switch
  • Confluence and heat conduction integrated device of lithium battery protection board MOS switch

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Embodiment Construction

[0028] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0029] The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0030] Such as figure 1 and figure 2 As shown, a confluence and thermal conduction integrated device of a lithium battery protection board MOS switch includes a PCBPCB, the PCB includes an insulating substrate 1, and also includes a PCB tinned copper foil 2 arranged on the insulating substrate 1, and the tinned copper foil 2 is also provided with a component 3 and a busbar 4, the pins of the component 3 are soldered on the wiring surfaces of different tinned copper foils 2, and the busbar 4 is fixedly connected to the PCB;

[0031] A heat dissipation aluminum plate 5 is also provided, and the heat dissipation aluminum plate 5 is arranged on the side of the bus 4 away from the PCB.

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Abstract

The invention provides a confluence and heat conduction integrated device of a lithium battery protection board MOS switch. The device comprises a PCB on which tinned copper foils are arranged, and is characterized in that components and confluence pieces are also arranged on the tinned copper foils, pins of the components are welded on the wiring surfaces of different tinned copper foils, and the confluence pieces are fixedly connected with the PCB; a heat dissipation aluminum plate is further arranged and is arranged at the sides, away from the PCB, of the confluence pieces. The confluence and heat conduction integrated device of the lithium battery protection board MOS switch has the beneficial effects that the heat conduction efficiency is improved, and the heat dissipation capability of the lithium battery protection plate is improved; the common PCB is used for replacing an existing heat dissipation mode through an aluminum-based PCB, so that the cost is reduced.

Description

technical field [0001] The invention belongs to the field of heat dissipation structure of a protection board, and in particular relates to a confluence and heat conduction integrated device of a MOS switch of a lithium battery protection board. Background technique [0002] In the circuit design of small and medium power power conversion / static electronic switches, the copper foil cross-sectional area of ​​the PCB is insufficient to pass a large current. Generally, measures such as stacking tin on the copper strip, adding soldering copper wires, and copper busbars are used to increase the power. The cross-sectional area of ​​the current channel of the circuit reduces the impedance of the power circuit, reduces power loss, improves efficiency, and also reduces heat generation, which is beneficial to the heat dissipation design of the product. [0003] The MOS tube in the power circuit is the main heat source. The plug-in MOS tube can be fixed on the radiator through the heat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/0203H05K1/0209H05K1/181H05K2201/066H05K2201/10166
Inventor 陈健王文申
Owner TIANJIN LANGBO MICROELECTRONICS
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