Substrate for mounting electronic element, and electronic device
A technology for electronic component installation and electronic components, which is applied in the direction of electrical components, electric solid devices, circuits, etc., and can solve problems such as bad, short-circuited electrodes, etc.
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no. 1 Embodiment approach
[0025] refer to Figure 2 to Figure 5 , the electronic component mounting substrate 1 and the electronic device 21 including the same according to the first embodiment of the present disclosure will be described. In addition, in this embodiment, in Figure 2 to Figure 5 The electronic device 21 is shown in .
[0026] The electronic component mounting substrate 1 has a substrate 2a having a mounting region 4 on which an electronic component 10 is mounted on the upper surface, and has a notch 7 on the outer periphery in a planar perspective. On the upper surface of the substrate 2a, there is a frame body 2d designed to surround the mounting area 4. As shown in FIG. The frame body 2d has a flow path 6 having an inner end 61 located on the inner wall of the frame body 2d and an outer end 62 located on the outer periphery of the frame body 2d or the substrate 2a. The outer end 62 of the flow path 6 is continuous with the notch 7 .
[0027] The electronic component mounting subs...
no. 2 Embodiment approach
[0083] refer to Image 6, the electronic component mounting substrate 1 and the electronic device 21 including the same according to the second embodiment of the present disclosure will be described. The difference from the first embodiment lies in the shape of the notch 7 of the substrate 2a.
[0084] exist Image 6 In the example shown, the notch 7 has a U-shape or a U-shape. Since the notch 7 is U-shaped or U-shaped, it is compatible with figure 2 Compared with the semicircular notch 7 in the illustrated example, it is easier to ensure the area of the opening at the outer end of the flow path 6 . Therefore, troubles at the time of injecting / expelling air using the flow path 6 can be reduced. In addition, in Image 6 In the example shown, the notch 7 can be made sufficiently larger than the flow path 6 . Thereby, even if a positional deviation occurs, the position of the flow path 6 can be accommodated in the cutout portion 7 . Therefore, although the position of t...
no. 3 Embodiment approach
[0088] refer to Figure 7 as well as Figure 8 , the electronic component mounting substrate 1 and the electronic device 21 including the same according to the third embodiment of the present disclosure will be described. The difference from the first embodiment is that the size of the notch 7 of the substrate 2 a in the Z direction is different when viewed in a longitudinal section. exist Figure 7 as well as Figure 8 In the example shown, the size of the notch 7 in the Z direction is small, and it is arranged only in the direction of the lower surface. Thereby, the electronic component mounting substrate 1 and the electronic device 21 equipped with the same have a shape without the notch 7 in a planar perspective. Therefore, it is possible to reduce the possibility of entrapment of dust falling from above the electronic component mounting substrate 1 and the electronic device 21 equipped therewith.
[0089] The outer shape of the board|substrate 1 for mounting electron...
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