Structured light and TOF technology fused 3D imaging device

An imaging device and structured light technology, which are applied in measurement devices, re-radiation of electromagnetic waves, utilization of re-radiation, etc., to achieve the effect of reducing the size of the module, improving the integration, and increasing the scope of application scenarios

Pending Publication Date: 2021-08-10
深圳市安思疆科技有限公司
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Problems solved by technology

[0005] The structured light technology and time-of-flight technology currently on the market appear in the form of their own independent applications, such as the technical content described in the Chinese patent application with the publication number CN109343070A and the publication number CN206805630U. Although each has its own advantages in different imaging distances, they cannot Fully combine the advantages of both

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  • Structured light and TOF technology fused 3D imaging device
  • Structured light and TOF technology fused 3D imaging device
  • Structured light and TOF technology fused 3D imaging device

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Embodiment Construction

[0042] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, therefore, the present invention is not limited to the specific embodiments disclosed below limit.

[0043] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0044]In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it c...

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Abstract

The invention discloses a structured light and TOF technology fused 3D imaging device, comprising: a projection module (10) which comprises a light source (101), a collimating lens (102) and a diffractive optical element (103); the projection module (10) has a structured light emission mode and a TOF emission mode; in the structured light working mode, the projection module projects a structured light pattern to a target object; and in the TOF emission mode, the projection module projects a floodlight illumination pattern to the target object. The device further comprises a receiving module (20) which is used for collecting an optical signal emitted by the target object; and a control calculation module (30) which is used for controlling the projection module (10) and the receiving module (20) and calculating the depth information of the target object according to the optical signal acquired by the receiving module (20). According to the device, two working modes of structured light and TOF technology are fused, other component structures do not need to be added, the number of integrated components is reduced, the module size is reduced, the integration degree is effectively improved, and the application scene range of the device is greatly widened.

Description

technical field [0001] The invention relates to the field of optoelectronic technology, in particular to a method for integrating structured light and time-of-flight technology and a 3D imaging device. Background technique [0002] 3D imaging devices have begun to be used in some electronic consumer products in the market, such as motion recognition for somatosensory games, and structured light 3D face recognition for the new generation of iPhones. 3D imaging devices can greatly enrich user experience and enhance product competitiveness, especially 3D face recognition. Compared with 2D face recognition, due to the addition of one-dimensional information, the latter cannot be compared in terms of experience and security. comparable. Compared with traditional biometrics, such as fingerprint recognition, 3D face recognition is a step higher in reliability and security. [0003] Different from traditional 2D imaging devices, such as cameras, which can only obtain plane 2D info...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01S17/89G01S17/10
CPCG01S17/10G01S17/89
Inventor 陈驰李安张俊君
Owner 深圳市安思疆科技有限公司
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