Mask assembly and method for manufacturing of the same
A mask component and mask technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of size limitation and increase of mask component size, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0059] Herein, the present invention will now be described more fully with reference to the accompanying drawings, in which some example embodiments of the invention are shown. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
[0060] It will also be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or one or more intervening layers may also be present. Throughout the specification, the same reference numerals designate the same or similar components. The shapes, dimensions, ratios, angles, numbers, etc. disclosed in the drawings for describing the embodiments may be examples, and the present invention is not limited to the illustrated ...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


