Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Frequency division optimization processing audio chip and earphone

An audio chip and audio processing technology, applied in earpiece/headphone accessories, frequency/direction characteristic devices, transducer circuits, etc., can solve problems such as noise, affecting the user's hearing experience, low efficiency, etc., and achieve the effect of good sound quality

Pending Publication Date: 2021-08-13
昆山海菲曼科技集团有限公司
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In existing earphones, usually only a single amplifier is used to amplify all audio signals, which makes the amplifier amplify audio signals with different frequencies, which may be caused by the characteristics of the amplifier itself. Different performance degradation occurs during the process
[0003] When a low-frequency audio signal is amplified by a low-frequency common type amplifier, due to the low efficiency of the low-frequency common type amplifier when amplifying the audio signal, it requires a considerable amount of power when the low-frequency common type amplifier is used to amplify the low-frequency audio signal In order to make the amplified audio signal enough to drive the woofer
On the other hand, when the mid-high frequency audio signal is amplified by the mid-high frequency commonly used type amplifier, since the mid-high frequency commonly used type amplifier has a high degree of distortion when amplifying the audio signal, the amplified mid-high frequency audio signal will pass through the loudspeaker There will be noise during playback, affecting the user's listening experience

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Frequency division optimization processing audio chip and earphone
  • Frequency division optimization processing audio chip and earphone

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] This embodiment provides an audio chip 100 for frequency division optimization processing, please refer to figure 1 , comprising: an audio processing circuit 1, a switching unit 2, a first filtering unit 3, a first type amplifier 5, a second filtering unit 4 and a second type amplifier 6; the audio processing circuit 1 is used to receive an input audio signal SI, and according to Set the frequency and perform frequency division processing on the input audio signal SI, so as to obtain the first bandwidth audio signal SF1 lower than the set frequency and the second bandwidth audio signal SF2 higher than the set frequency; the switching unit 2 is connected to the audio processing circuit 1 , used to conduct the first bandwidth audio signal SF1 and the second bandwidth audio signal SF2 in response to the control CI of the audio processing circuit 1; The audio signal SF1 undergoes a controllable filtering process to generate a first filtered audio signal SL1; the first type ...

Embodiment 2

[0040] This embodiment provides an earphone, which has the above-mentioned audio chip 100 for frequency division optimization processing, and has the same performance, which will not be repeated here.

[0041] Specifically, the earphone further includes a left speaker and a right speaker.

[0042] Specifically, the left speaker includes at least the first speaker 7 and the second speaker 8 ; the right speaker includes at least the first speaker 7 and the second speaker 8 .

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a frequency division optimization processing audio chip and an earphone. The frequency division optimization processing audio chip comprises an audio processing circuit, a switching unit, a first filtering unit, a first type amplifier, a second filtering unit and a second type amplifier; the audio processing circuit carries out frequency division processing on audio signals, so that the switching unit can transmit the audio signals with different frequencies to the filtering units and the amplifiers with different characteristics for processing according to a frequency division processing result; therefore, excessive power consumption is avoided during processing of audio signals in a reproduction frequency range and frequency-divided low-frequency signals, and better tone quality can be achieved during processing of audio signals outside the reproduction frequency range and frequency-divided medium-high-frequency signals.

Description

technical field [0001] The invention relates to the field of audio output equipment, in particular to an audio chip and an earphone for frequency division optimization processing. Background technique [0002] In existing earphones, usually only a single amplifier is used to amplify all audio signals, which makes the amplifier amplify audio signals with different frequencies, which may be caused by the characteristics of the amplifier itself. Different performance degradation scenarios occur during the process. [0003] When a low-frequency audio signal is amplified by a low-frequency common type amplifier, due to the low efficiency of the low-frequency common type amplifier when amplifying the audio signal, it requires a considerable amount of power when the low-frequency common type amplifier is used to amplify the low-frequency audio signal In order to make the amplified audio signal enough to drive the woofer. On the other hand, when the mid-high frequency audio signal...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H04R3/00H04R1/22H04R1/10
CPCH04R3/00H04R1/22H04R1/1091
Inventor 边仿
Owner 昆山海菲曼科技集团有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com