A rcled lamp bead packaging process
A packaging process and lamp bead technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems that affect the overall effect of light spots, cannot eliminate reflection effects, and form light spots, etc., achieve slow flow, improve dispensing accuracy, reduce The effect of small dispensing volume
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[0036] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0037] It should be noted that the terms "first", "second" and similar expressions used herein are for the purpose of illustration only, and do not represent the only implementation manner.
[0038] An RCLED lamp bead packaging process, the process specifically includes the following steps:
[0039] Step 1, apply the crystal-bonding glue, put the crystal-bonding glue into the designated position of the lamp bead bracket (1), and the lamp bead bracket (1) includes the lead frame (8);
[0040] Step 2, install the chip, put the RCLED chip (2) into the glue dispensing area of the lamp bead bracket, the RCLED chip (2) includes the light-emitting hole (4), PAD (7);
[0041] Step 3, baking to solidify the crystal-bonding glue, the crystal-bonding glue...
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