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A rcled lamp bead packaging process

A packaging process and lamp bead technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems that affect the overall effect of light spots, cannot eliminate reflection effects, and form light spots, etc., achieve slow flow, improve dispensing accuracy, reduce The effect of small dispensing volume

Active Publication Date: 2022-02-01
PSG OPTO DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the light emitted by the RCLED passes through the lens, part of the light will be reflected by the lens, and the light spot reflected by the lens will be reflected again by the functional area and bonding wire in the RCLED lamp bead, which will affect the emitted RCLED light spot. Causes impact, forming spots or ghosting, seriously affecting the overall effect of the spot
[0004] The traditional LED lamp bead packaging process cannot eliminate the above-mentioned reflection effect

Method used

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  • A rcled lamp bead packaging process
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Embodiment Construction

[0036] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0037] It should be noted that the terms "first", "second" and similar expressions used herein are for the purpose of illustration only, and do not represent the only implementation manner.

[0038] An RCLED lamp bead packaging process, the process specifically includes the following steps:

[0039] Step 1, apply the crystal-bonding glue, put the crystal-bonding glue into the designated position of the lamp bead bracket (1), and the lamp bead bracket (1) includes the lead frame (8);

[0040] Step 2, install the chip, put the RCLED chip (2) into the glue dispensing area of ​​the lamp bead bracket, the RCLED chip (2) includes the light-emitting hole (4), PAD (7);

[0041] Step 3, baking to solidify the crystal-bonding glue, the crystal-bonding glue...

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PUM

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Abstract

The invention discloses an RCLED lamp bead packaging process. The method comprises the following steps: spotting crystal glue, installing chips, baking, welding and bonding wires, spotting the first layer of anti-reflection glue, baking, spotting the second layer of anti-reflection Reflective glue, baking, testing, by dotting anti-reflective glue on the corresponding area of ​​the RCLED lamp bead, the reflective part of the RCLED lamp bead is blocked, effectively eliminating the reflective effect of the RCLED lamp bead, and improving the light emission of the RCLED lamp bead. effect, making the light spot clearer and more precise. The viscosity of the first layer of anti-reflective adhesive has a certain fluidity, which can make the anti-reflective adhesive quickly fill the designated area, and the production efficiency is high. The viscosity of the second layer of anti-reflection glue is higher, and the flow of glue is slow after dispensing, which improves the precision of dispensing glue and can effectively prevent the anti-reflection glue from blocking the light-emitting hole of the RCLED chip. When welding the bonding wire, the bracket is the first soldering point, and the PAD of the RCLED chip is the second soldering point, so that the arc of the bonding wire is lower, the lamp bead has a good shape, and the amount of glue is reduced to save production. cost.

Description

technical field [0001] The invention relates to the technical field of lamp bead packaging, in particular to an RCLED lamp bead packaging process. Background technique [0002] RCLED, namely Resonant Cavity Light Emitting Diode, the English full name is "Resonant Cavity Light Emitting Diode", is a new type of light emitting diode structure, which has the advantages of both traditional LED and vertical cavity surface laser (VCSEL), through its microcavity effect The function changes the mode of spontaneous emission in the active region, and then limits the frequency and angle of the radiation spectrum, which can greatly improve the internal and external quantum efficiency. It is a very excellent structure for preparing high-brightness LEDs. [0003] Due to the advantages of RCLEDs, RCLEDs are usually used as emission light sources in fields such as sights. But when the light emitted by the RCLED passes through the lens, part of the light will be reflected by the lens, and th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/44H01L33/52H01L33/62
CPCH01L33/005H01L33/44H01L33/52H01L33/62H01L2933/0025H01L2933/005H01L2933/0066H01L33/105H01L33/486H01L33/56G02B1/11F21Y2115/10F21K9/60F21K9/90F21V19/0025F21V23/002
Inventor 苏三
Owner PSG OPTO DEV CO LTD
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