The invention discloses an RCLED lamp bead packaging process, which comprises the following steps of dispensing solid crystal glue, mounting a chip, baking, welding a bonding wire, dispensing a first layer of anti-reflection glue, baking, dispensing a second layer of anti-reflection glue, baking and testing. The anti-reflection glue is dispensed in a corresponding area of an RCLED lamp bead, so that a part capable of reflecting light in the RCLED lamp bead is shielded; the reflection effect of the RCLED lamp bead is effectively eliminated, the light spot emitting effect of the RCLED lamp bead is improved, and the light spots are clearer and more accurate. And the viscosity of the first layer of anti-reflection glue has certain flowability, so that the anti-reflection glue can be rapidly filled in a specified area, and the production efficiency is high. And the second layer of anti-reflection glue is relatively high in viscosity and flows slowly after glue dispensing, so that the glue dispensing precision is improved, and the anti-reflection glue can be effectively prevented from shielding a light-emitting hole of the RCLED chip. When the bonding wire is welded, the support is the first welding spot, and the PAD of the RCLED chip is the second welding spot, so that the radian of the bonding wire is lower, the lamp bead has a good appearance, the dispensing amount is reduced, and the production cost is saved.