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A high-performance electromagnetic radiation suppression structure

An electromagnetic radiation, high-performance technology, applied in the reduction of crosstalk/noise/electromagnetic interference (, electrical components, circuit devices, etc., can solve problems such as radiation deterioration, achieve the effects of suppressing radiation, expanding the absorption range, and reducing costs

Active Publication Date: 2022-08-05
海宁利伊电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But grounding only has a certain effect on low frequencies, and high frequencies may worsen the radiation

Method used

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  • A high-performance electromagnetic radiation suppression structure
  • A high-performance electromagnetic radiation suppression structure
  • A high-performance electromagnetic radiation suppression structure

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Experimental program
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Embodiment Construction

[0035] The present invention will be further described below in conjunction with the accompanying drawings and implementation examples.

[0036] like figure 1 As shown, including a heat dissipation cover 1 and a PCB board 7 and a metamaterial wave absorber and a graphene resistive surface arranged in an array, the heat dissipation cover 1 is located above the PCB board 7, and the PCB board 7 is provided with a chip package 5, and the chip package 5 It is connected with the bottom surface of the heat dissipation cover 1 by thermally conductive adhesive 4. There is an air gap 6 between the heat dissipation cover 1 and the PCB board 7 around the chip package 5. Periodically arranged metamaterials are arranged in the area of ​​the air gap 6 near the heat dissipation cover 1. The wave absorber 2, so that the chip package 5 is arranged with a metamaterial wave absorber 2, and the metamaterial wave absorber 2 is used to absorb edge radiation; the metamaterial wave absorber 2 is fixed...

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PUM

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Abstract

The invention discloses a high-performance electromagnetic radiation suppression structure. Periodically arranged metamaterial absorbers are added between the heat dissipation cover and the PCB board, and graphene resistive surfaces are added at the same time to improve the shielding effect and achieve electromagnetic radiation suppression in the required frequency band. It is composed of a lossy dielectric layer and an all-metal backplane. The metamaterial absorber is arranged under the heat dissipation cover, keeping a certain distance from the PCB board, and the position of the thermal conductive adhesive is vacated in the middle. Loading the graphene structure above the thermal conductive adhesive is effective. Suppresses radiation leakage directly upward from the chip package. The invention is suitable for electromagnetic radiation suppression of packaged devices, and the introduction of metamaterial structure realizes the characteristics of miniaturization and polarization insensitivity of the shielding structure, and has good radiation absorption capability in the working frequency band. It has great application value in the packaging design of chips and PCB boards.

Description

technical field [0001] The invention relates to the technical field of metamaterial absorbers and electromagnetic shielding, in particular to a high-performance electromagnetic radiation suppression structure, which can be applied to radiation suppression in modern commercial communications, chips and PCB board packaging. Background technique [0002] The advent of the 5G era has increased the operating frequency and integration of modern electronic devices, and electromagnetic interference and heat dissipation have become important challenges for the next generation of electronic products. In chip packaging, in order to ensure normal heat dissipation during operation, thermally conductive adhesive is usually used to connect the heat dissipation cover and the chip package. The traditional heat dissipation cover is generally made of metal with high conductivity, which inevitably leads to the formation of a resonant cavity between the heat dissipation cover and the PCB board, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H01Q15/00H01Q17/00
CPCH05K1/0216H01Q15/0086H01Q17/00
Inventor 李尔平雷晓勇李燕孙喆
Owner 海宁利伊电子科技有限公司
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