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Packaging structure, circuit board assembly and electronic equipment

A technology of circuit board assembly and packaging structure, which is applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of unfavorable miniaturization of electronic equipment and large layout area of ​​the main board, so as to meet the development needs of miniaturization, reduce the area of ​​the main board, Optimize the effect of motherboard layout

Active Publication Date: 2021-08-24
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This application aims to provide a packaging structure, circuit board assembly and electronic equipment to solve the need A large number of electrical connectors are arranged on the main board, resulting in a large layout area of ​​the main board, which is not conducive to the miniaturization of electronic equipment

Method used

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  • Packaging structure, circuit board assembly and electronic equipment
  • Packaging structure, circuit board assembly and electronic equipment
  • Packaging structure, circuit board assembly and electronic equipment

Examples

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Embodiment Construction

[0026] Embodiments of the present application will be described in detail below, examples of which are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and should not be construed as limiting the present application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0027] The features of the terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of these features. In the description of the present application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification ...

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Abstract

The invention discloses a packaging structure, a circuit board assembly and electronic equipment. The packaging structure comprises a packaging carrier plate, a packaging device, a first connecting piece, a first electric connecting part and a packaging layer, and the packaging carrier plate is provided with a first surface and a second surface which are oppositely arranged; the packaging device is connected with the first surface of the packaging carrier plate; one end of the first connecting piece is connected with the first surface of the packaging carrier plate, and the first electric connecting part is connected to one end, far away from the first surface, of the first connecting piece; and the packaging layer is arranged on the first surface of the packaging carrier plate, the packaging layer covers the packaging device and the first connecting piece, and the first electric connecting part is arranged outside the packaging layer. According to the scheme of arranging the electric connecting pieces on the packaging layer of the packaging structure, the layout of the mainboard of the electronic equipment can be improved, so that the area of the mainboard is reduced, and miniaturization of the electronic equipment is facilitated.

Description

technical field [0001] The application belongs to the technical field of packaging, and in particular relates to a packaging structure, a circuit board assembly and electronic equipment. Background technique [0002] Today, electronic devices have become a common tool in our daily life. Generally, the encapsulation structure needs to be packaged on the main board (such as a circuit board) in the electronic equipment, so as to realize some functions of the circuit board through the encapsulation structure. [0003] At present, the existing packaging structure is usually electrically connected to the main board of the electronic device through the solder pads or solder balls provided at the bottom. The electrical connection of the packaging structure with other electronic components or modules on the main board of the electronic device requires additional special aids. Electrical connectors or electrical connectors such as conductive shrapnel are provided. This leads to the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/48H01L23/49
CPCH01L23/481H01L23/49H01L2224/16227H01L2224/48227H01L2224/73265H01L2924/15311H01L2924/1533H01L2924/19105H01L2224/97H01L2224/81
Inventor 杨彩红杨俊
Owner VIVO MOBILE COMM CO LTD