High-efficiency PSoC chip based on SiP technology and packaging structure thereof

Abstract

The invention discloses a high-efficiency PSoC chip based on SiP technology. The chip comprises a processor bare core, a plurality of DDR bare cores, a plurality of Flash bare cores, a dual-power bus transceiver bare core, a power supply chip and a plurality of resistance-capacitance discrete devices, and all the bare cores, the finished chips and the plurality of resistance-capacitance discrete devices are packaged into a whole through the SiP technology, so that the board area of a board card can be saved, the hardware cost is reduced, the design difficulty of the board card is reduced, and miniaturization and high integration of the embedded board card are realized; a PSoC chip packaging structure adopts an EHS-FCBGA packaging mode and comprises a heat dissipation cover, the peripheral edge of the heat dissipation cover is a first bonding area, the position, corresponding to a bare chip, of the heat dissipation cover is concaved inwards to form a special-shaped groove, and the depth of the special-shaped groove is equal to the sum of the vertical height of the highest bare chip after RDL and the thickness of heat-conducting glue; a boss is arranged at the bottom of the special-shaped groove; and the heat dissipation cover adopts a tiled special-shaped stamp mode, so that the size of the chip is reduced, and the bonding strength and the heat dissipation performance are also considered.

Description

technical field [0001] The invention relates to the technical field of digital signal processing and control chips, in particular to a high-efficiency PSoC chip based on SiP technology. Background technique [0002] With the rapid development of electronic equipment in the direction of short, light, small, thin, high reliability, high performance, high speed, and low cost, the demand for miniaturization and modularization of processing and control systems is becoming more and more urgent. Therefore, it is urgent to use multi-chip component technology to form a functional and highly reliable electronic component system by interconnecting and assembling ICs such as microprocessors, FPGAs, memory and interfaces on high-density multi-layer interconnection substrates to realize processing and Miniaturization and high-density integration of control systems. [0003] At present, most of the existing systems integrating processing, control and storage in the market adopt the archit...

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Problems solved by technology

[0003] At present, most of the existing systems integrating processing, control and storage in the market adopt the architecture of MCU controller + FPGA + storage or directly adopt the method of external expansion storage of FPGA with ARM processor, all of which are separated device design schemes. The overall area is large, the integration level is low, and it is difficult to resist electromagnetic interference

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