Diamond wire cutting double-wire mechanism

Abstract

The invention discloses a diamond wire cutting double-wire mechanism. The diamond wire cutting double-wire mechanism comprises a supporting column, an adjustable wire roller plate assembly, a supporting wire roller plate assembly, a wire roller assembly, a buffer assembly, a bearing transition assembly and a wire arrangement guide wheel. Double wires are arranged in a double-wire groove, winding of the double wires can be effectively avoided, and overall running of the mechanism is guaranteed. A sliding block horizontally moves to different adjusting holes in a sliding groove base, a thread fixing piece penetrates the adjusting holes to fix a connecting block, the sliding block and the sliding groove base, accordingly, the distance between a first wire roller and a second wire roller is adjusted according to the length of a diamond wire, the tension of the diamond wire is further adjusted, adaptability is extremely good, accordingly, the angle range of the stress point of the diamond wire is guaranteed, and the stress reverse action borne by the diamond wire during cutting is greatly reduced. Through a positioning connecting rod and a positioning plate, the limiting function on the connecting block can be achieved, and the sliding block horizontally moves on the same horizontal line during adjustment of the sliding block and the sliding groove base.

Description

technical field [0001] The invention relates to diamond wire cutting, in particular to a diamond wire cutting double wire mechanism. Background technique [0002] Diamond wire cutting adopts the unidirectional or reciprocating circular motion of the diamond wire to form a relative grinding motion between the diamond wire and the object to be cut, so as to achieve the purpose of cutting. As a new cutting method, diamond wire cutting is widely used in the field of crystalline silicon wafers. By uniformly fixing diamond particles on high-strength steel wires with a certain distribution density, by repeatedly winding diamond wires on several On the wire device, the diamond wire is pulled back and forth at high speed to complete the cutting of the object. The existing diamond wire wire device usually installs guide rollers at both ends of the upper and lower plates, so that the diamond wire is inserted into the grooves of each guide roller in a square shape. For example: CN20182...

AI Technical Summary

Problems solved by technology

In the process of wire take-up and pay-off, the contact between the diamond wire and the diamond wire can be effectively reduced, but there are many problems in the double-wire cutting. When double-wire cutting is used, double-wire winding is easily generated, which affects the overall The use of the diamond wire is straight and square and interspersed in the grooves of each guide roller. The diamond wire and the wire roller cannot be adjusted according to the position. The stress on the diamond wire acts in the opposite direction during cutting, and the angle of the stress point of the wire is small. The diamond wire is easily broken from both ends, affecting the overall use

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