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Thin film circuit board

A thin-film circuit board and circuit substrate technology, which is applied in the directions of printed circuit components, conductive pattern layout details, and electrical connection of printed components, etc., can solve problems such as the influence of circuit signal transmission functions, the influence of circuit characteristics, and the failure of thin-film circuit boards.

Active Publication Date: 2021-09-14
重庆达方电子有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002]The thin film circuit board of the keyboard has a layered structure. During use, external chemical substances may enter the thin film circuit board and react with the circuit to affect the circuit characteristics
For example, the sulfur in the external chemical substances and the wires (such as silver wires) in the thin film circuit board produce sulfide. When the reaction is serious, the signal transmission function of the circuit may be affected, and even the thin film circuit board will fail.

Method used

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Embodiment Construction

[0035] In order to have a further understanding of the purpose, structure, features, and functions of the present invention, the following detailed descriptions are provided in conjunction with the embodiments.

[0036] see figure 1 and figure 2 , the thin film circuit board 1 according to an embodiment, for example but not limited to, can be applied in a keyboard, which includes a laminated board structure 12 , a first circuit layer 14 and a second circuit layer 16 . The layered plate structure 12 comprises a first circuit substrate 122, a second circuit substrate 124 and an insulating layer 126 arranged between the first circuit substrate 122 and the second circuit substrate 124, the first circuit substrate 122, the second circuit substrate 124 and the insulating layer 126. Layer 126 in the vertical direction D1 (indicated by double arrows on figure 2 middle) overlay. The first circuit layer 14 forms a circuit (not completely shown in figure 1 Middle) on the first surf...

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Abstract

The invention discloses a thin film circuit board which comprises a layered plate structure, and a circuit arranged in the layered plate structure. The layered plate structure comprises a first circuit substrate, a second circuit substrate and an insulating layer arranged between the first circuit substrate and the second circuit substrate. In one embodiment, the thin film circuit board includes a wire barrier structure disposed between the first circuit substrate and the insulating layer and adjacent to a wire formed on the first circuit substrate to block or suppress a reaction between an external chemical substance and the wire. In another embodiment, the thin film circuit board comprises a through hole blocking structure which surrounds the through hole of the layered plate structure and is arranged between the first circuit substrate and the insulating layer so as to block or inhibit external chemical substances from entering the layered plate structure to react with internal circuits.

Description

technical field [0001] The invention relates to a thin film circuit board, especially a thin film circuit board which can be used for a keyboard. Background technique [0002] The thin film circuit board of the keyboard has a layered structure. During use, external chemical substances may enter the thin film circuit board and react with the circuit to affect the circuit characteristics. For example, the sulfur in the external chemical substances and the wires (such as silver wires) in the thin film circuit board produce sulfides. When the reaction is severe, the signal transmission function of the circuit may be affected, and the thin film circuit board may even fail. In this regard, in the production of thin film circuit boards, thin film circuit boards must pass the vulcanization test to meet product specifications. Therefore, how to design a thin film circuit board that can pass the vulcanization test and still maintain electrical conductivity is one of the key developme...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/11
CPCH05K1/0298H05K1/02H05K1/11
Inventor 蔡柏伟郑振东
Owner 重庆达方电子有限公司
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