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A printed circuit board and method of making the same

A technology for printed circuit boards and production methods, which is applied in the directions of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of high impedance of transmission lines and low line width of PCB transmission lines.

Active Publication Date: 2022-07-26
ZHEJIANG UNIVIEW TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a printed circuit board and a manufacturing method to solve the problem of high impedance of the transmission line caused by the low channel width of the existing PCB transmission line

Method used

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  • A printed circuit board and method of making the same
  • A printed circuit board and method of making the same
  • A printed circuit board and method of making the same

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Embodiment Construction

[0034] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all structures related to the present invention.

[0035] figure 1 It is a schematic top-view structure diagram of a transmission line in the background technology, figure 2 is a schematic top-view structure diagram of another transmission line in the background technology, figure 1 Shown is the graphic structure parallel to the plane of the printed circuit board. According to the relevant regulations in international standards, the general single-line impedance needs to meet the control requirements of 50ohm. In order to achieve the 50ohm impedance control requirements of the t...

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Abstract

The invention discloses a printed circuit board and a manufacturing method, wherein the printed circuit board comprises: at least one insulating medium layer and at least one transmission line layer; the insulating medium layer and the transmission line layer are alternately arranged; the transmission line layer It includes a transmission line, the transmission line includes a wiring main body and a protruding part, the protruding part extends in the direction of the insulating medium layer, and the extending direction of the protruding part is perpendicular to the extending direction of the wiring main body; The protruding part is arranged on one side or both sides of the wiring main body; the insulating medium layer close to the protruding part and the side away from the wiring main body includes a groove, and the groove is connected to the protruding part. The parts correspond one by one, and the protruding parts are matched with the corresponding grooves. The invention provides a printed circuit board and a manufacturing method, so as to improve the problem of high impedance of the transmission line caused by the low line width of the channel limitation of the existing PCB transmission line.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a printed circuit board and a manufacturing method. Background technique [0002] Printed Circuit Board (PCB) is an important part of electronic products, and the communication signals between chips and components are transmitted using transmission lines on the PCB as a carrier. [0003] When designing a transmission line, in order to ensure signal integrity, it is necessary to consider impedance control. For example, the general single-line impedance is 50ohm. In some special design occasions, such as capacitive compensation, the single-line impedance is required to be controlled within the range of less than 50ohm. [0004] The impedance of a transmission line is inversely proportional to the line width, and the smaller the line width, the greater the impedance. In some areas where space is relatively tight, a large number of signal lines need to be run. Due to the limitati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/00H05K3/46
CPCH05K1/0298H05K1/115H05K3/0011H05K3/0017H05K3/0044H05K3/4626
Inventor 蔡步森
Owner ZHEJIANG UNIVIEW TECH CO LTD
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