Circuit board electroplating rack
A technology for electroplating racks and circuit boards, which is applied to printed circuits, printed circuit manufacturing, and electrolytic components. It can solve the problems that the thickness of the plating layer cannot be kept uniform and affects the overall quality of the circuit board. It is not easy to achieve the electroplating effect and the clamping position is stable. Effect
Active Publication Date: 2021-09-28
珠海松柏科技有限公司 +2
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Problems solved by technology
[0004] In view of the above-mentioned related technologies, the inventor believes that the circuit board is processed by the vertical electroplating process. At this time, the overall coating thickness of the circuit board cannot be kept uniform during the processing process, thereby affecting the overall quality of the processed circuit board.
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[0035] The application will be described in further detail below in conjunction with the accompanying drawings.
[0036] A circuit board electroplating hanger disclosed in the application can clamp the circuit board and keep the circuit board in a horizontal state.
[0037] Such as figure 1 As shown, a circuit board electroplating hanger includes a frame body 1, two transmission chains 2 connected to the frame body 1, and several clamping frames 3 arranged on the transmission chain 2. The frame body 1 is rotatably connected with several sprockets, The axes of the sprockets are arranged vertically, and the transmission chain 2 is sleeved on several sprockets at the same time. The frame body 1 is connected with a motor that drives the rotation of the sprocket 21 using bolts, and the output shaft of the motor is coaxially connected with a sprocket 21 through a flat key. Such as figure 2 As shown, the clamping frame 3 is arranged along the conveying direction of the transmissi...
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The invention relates to a circuit board electroplating rack. The circuit board electroplating rack comprises a rack body, a transmission chain and a plurality of clamping frames, each clamping frame comprises a first clamping rod, a first clamping plate, a second clamping rod and a second clamping plate, the first clamping plates and the second clamping plates are horizontally arranged, the second clamping plates and the first clamping plates clamp circuit boards, the first clamping rods are connected to the transmission chain, the first clamping rods are connected with clamping mechanisms, each clamping mechanism comprises a connecting rod and an abutting rod, the abutting rods are arranged at the ends, close to the second clamping rods, of the connecting rods, the ends, away from the connecting rods, of the abutting rods are connected to the second clamping rods, limiting blocks for limiting upward rotation of the connecting rods are arranged on the side walls, connected with the connecting rods, of the first clamping rods, the upper ends of the connecting rods abut against the lower ends of the limiting blocks, and the ends, making contact with the second clamping rods, of the abutting rods are located on the sides, away from the second clamping rods, of the hinge axes of the connecting rods. The circuit board electroplating rack has the advantage that the circuit boards are horizontally clamped by using the first clamping plates and the second clamping plates, so that the circuit quality of the circuit boards is better.
Description
technical field [0001] The present application relates to the technical field of circuit board electroplating equipment, in particular to a circuit board electroplating hanger. Background technique [0002] Electroplating is an important process in the manufacturing process of circuit boards. It is the process of depositing and forming coatings on substrates by electrolytic methods. With the rapid development of microelectronics technology, the manufacturing of printed circuit boards is developing towards multi-layer and integration. It makes the circuit board manufacturing technology more difficult. [0003] At present, the electroplating industry usually uses an electroplating hanger to clamp the circuit board, and the circuit board remains vertical during the movement process. At this time, the circuit board remains vertical for electroplating. [0004] In view of the above-mentioned related technologies, the inventor believes that the circuit board is processed by verti...
Claims
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IPC IPC(8): C25D17/08H05K3/18
CPCC25D17/08H05K3/188
Inventor 饶猛肖阳
Owner 珠海松柏科技有限公司