Satellite baseband chip fixing device

Abstract

The invention provides a satellite baseband chip fixing device. The device comprises a grabbing arm, a suction head and a vacuum pump are arranged on the grabbing arm, the suction head is communicated with a vacuum pump gas path, a base station is arranged on one side of the grabbing arm, and a loading plate is placed on the base station. The device is characterized in that the loading plate is of a hollow structure; a groove for storing a chip is concavely formed in the surface of the loading plate, the center of the groove is provided with a through hole communicated with a cavity in the inner side of the loading plate, the loading plate is communicated with a vacuum pump gas path, fixing claws driven by the vacuum pump to be opened and closed are hinged to the periphery of the groove in the surface of the loading plate, gas path connection among the vacuum pump, the suction head and the loading plate is switched through an electric control valve, and gas path communication of the vacuum pump is controlled by the electric control valve. Smooth switching of the upper side and the lower side of the suction of the chip is achieved, the stability of the conveying of the chip is guaranteed, the loading precision of the chip is also improved, fixing claws on the surface of the loading plate are driven to fix the chips, the whole steps are smooth in changeover, the fixity of the chip is good, and a good development prospect is brought about.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a satellite baseband chip fixing device. Background technique [0002] The baseband chip refers to the chip used to synthesize the baseband signal to be transmitted, or to decode the received baseband signal. Specifically, it mainly completes the information processing function of the communication terminal. During the production process of the baseband chip, it is often necessary to grab and transfer the baseband chip between each process. The transfer of chips is carried out in a unique way, which not only causes little damage to the chips, but also holds relatively stable, which is suitable for the transfer of a large number of chips. [0003] For example, the application number is CN201811348142.1, an automatic chip patch fixing device, which absorbs and transfers the chip through the chip suction device, so as to realize the transfer of the chip from the conveying de...

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Problems solved by technology

[0003] For example, the application number is CN201811348142.1, an automatic chip patch fixing device, which absorbs and transfers the chip through the chip suction device, so as to realize the transfer of the chip from the conveying device to the fixing device. However, in the process of absorbing and transferring the chip , that is, during the transfer process of the chip from the suction device to the fixing device, since the suction device and the fixing device belong to two independent working systems, the chip needs to be fixed after the transfer, and there are problems of insufficient fluency and precision. The process is easy to cause damage to the chip

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